Inventor · disambiguated record
Takeshi Terasaki
Also filed as: TERASAKI TAKESHI
11 granted patents·5 pending applications·46 citations·filing 1997–2017
86Inventor score
Top patents by PatentIndex Score
16 records- 0182US10816965B2Manufacturing facility management optimization deviceHITACHI LTD·Filed 2017·Granted Oct 27, 2020·3 cites·5 claims
- 0272US8319330B2Semiconductor package having exterior plating films formed over surfaces of outer leadsMURAKAMI TOMOHIRO·Filed 2011·Granted Nov 27, 2012·4 cites·23 claims
- 0359US9734931B2Power-supply cable and apparatus for manufacturing electric wire used for said power-supply cableHITACHI METALS LTD·Filed 2014·Granted Aug 15, 2017·0 cites·2 claims
- 0458US9252793B2Semiconductor deviceTSUTSUMI TOSHIAKI·Filed 2010·Granted Feb 2, 2016·1 cites·16 claims
- 0554US6331730B1Push-in type semiconductor device including heat spreaderHITACHI LTD·Filed 1999·Granted Dec 18, 2001·18 cites·19 claims
- 0653US6465876B1Semiconductor device and lead frame thereforHITACHI LTD·Filed 1997·Granted Oct 15, 2002·16 cites·5 claims
- 0748US9503018B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·17 claims
- 0848US7298081B2Display apparatus with shell-structured vacuum sealHITACHI LTD·Filed 2005·Granted Nov 20, 2007·0 cites·3 claims
- 0947US6844219B2Semiconductor device and lead frame thereforRENESAS TECH CORP·Filed 2002·Granted Jan 18, 2005·2 cites·7 claims
- 1047US2015057987A1Method and apparatus for estimation of out-of-plane deformation of cableHITACHI METALS LTD·Filed 2014·Application pending·0 cites
- 1144US2005258736A1Display apparatus, its display module and display panelKAZAMA ATSUSHI·Filed 2005·Application pending·0 cites
- 1242US10937731B2Semiconductor module and method for manufacturing semiconductor moduleHITACHI LTD·Filed 2017·Granted Mar 2, 2021·0 cites·20 claims
- 1341US2007182023A1Semiconductor deviceHITACHI LTD·Filed 2007·Application pending·0 cites
- 1437US2009108420A1Semiconductor device and its fabrication processOKURA YASUTAKA·Filed 2008·Application pending·0 cites
- 1535US2002011661A1Push-in type semiconductor device including heat spreaderFiled 2001·Application pending·0 cites
- 1629US6232653B1TSOP type semiconductor deviceHITACHI LTD·Filed 1999·Granted May 15, 2001·2 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →