Inventor · disambiguated record
Takanori Teshima
Also filed as: TESHIMA TAKANORI
22 granted patents·4 pending applications·458 citations·filing 1980–2012
96Inventor score
Top patents by PatentIndex Score
26 records- 0194US8125781B2Semiconductor deviceMAMITSU KUNIAKI·Filed 2005·Granted Feb 28, 2012·37 cites·42 claims
- 0289US7019395B2Double-sided cooling type semiconductor moduleDENSO CORP·Filed 2004·Granted Mar 28, 2006·53 cites·13 claims
- 0389US6693350B2Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structureDENSO CORP·Filed 2002·Granted Feb 17, 2004·56 cites·25 claims
- 0485US7145254B2Transfer-molded power device and method for manufacturing transfer-molded power deviceDENSO CORP·Filed 2002·Granted Dec 5, 2006·45 cites·3 claims
- 0585US6384431B1Insulated gate bipolar transistorDENSO CORP·Filed 2000·Granted May 7, 2002·40 cites·5 claims
- 0682US6917103B2Molded semiconductor power device having heat sinks exposed on one surfaceDENSO CORP·Filed 2002·Granted Jul 12, 2005·33 cites·19 claims
- 0781US6963133B2Semiconductor device and method for manufacturing semiconductor deviceDENSO CORP·Filed 2002·Granted Nov 8, 2005·26 cites·6 claims
- 0877US7944045B2Semiconductor module molded by resin with heat radiation plate opened outside from moldDENSO CORP·Filed 2009·Granted May 17, 2011·7 cites·9 claims
- 0973US8963315B2Semiconductor device with surface electrodesFUKUOKA DAISUKE·Filed 2011·Granted Feb 24, 2015·4 cites·13 claims
- 1069US7009292B2Package type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 7, 2006·16 cites·15 claims
- 1168US10079226B2Semiconductor deviceMAMITSU KUNIAKI·Filed 2012·Granted Sep 18, 2018·2 cites·45 claims
- 1268US8441122B2Semiconductor device having semiconductor chip and metal plateFUKUOKA DAISUKE·Filed 2010·Granted May 14, 2013·3 cites·3 claims
- 1366US6946730B2Semiconductor device having heat conducting plateDENSO CORP·Filed 2004·Granted Sep 20, 2005·11 cites·7 claims
- 1464US6538308B1Semiconductor apparatus with heat radiation structure for removing heat from semiconductor elementDENSO CORP·Filed 1999·Granted Mar 25, 2003·28 cites·24 claims
- 1563US4451774AVehicle mounted voltage regulatorNIPPON DENSO CO·Filed 1982·Granted May 29, 1984·27 cites·11 claims
- 1662US7009284B2Semiconductor apparatus with heat radiation structure for removing heat from semiconductor elementDENSO CORP·Filed 2002·Granted Mar 7, 2006·10 cites·30 claims
- 1762US4477766AApparatus for controlling electric generation for vehiclesNIPPON DENSO CO·Filed 1982·Granted Oct 16, 1984·27 cites·5 claims
- 1851US7049688B2Semiconductor device having a pair of heat sinks and method for manufacturing the sameDENSO CORP·Filed 2004·Granted May 23, 2006·5 cites·6 claims
- 1950US7193326B2Mold type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 20, 2007·3 cites·23 claims
- 2049US7468318B2Method for manufacturing mold type semiconductor deviceDENSO CORP·Filed 2007·Granted Dec 23, 2008·0 cites·5 claims
- 2143US4321161ALiquid-absorbing shaped bodyTOKUYAMA SODA KK·Filed 1980·Granted Mar 23, 1982·18 cites·13 claims
- 2243US2010281862A1Marine diesel engineMITSUBISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 2343US2006145335A1Method for manufacturing semiconductor device having a pair of heat sinksDENSO CORP·Filed 2006·Application pending·0 cites
- 2436US2006055056A1Semiconductor equipment having a pair of heat radiation platesDENSO CORP·Filed 2004·Application pending·0 cites
- 2535US4418311ABattery charge indicating systemNIPPON DENSO CO·Filed 1982·Granted Nov 29, 1983·7 cites·13 claims
- 2635US2008295516A1TurbochargerTESHIMA TAKANORI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →