Method for manufacturing semiconductor device having a pair of heat sinks

Abstract

A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold for molding the heater element and the first and second heat sinks. The first heat sink includes a first heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The second heat sink includes a second heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The first and second heat radiation surfaces have a degree of parallelism therebetween equal to or smaller than 0.2 mm.

1 - 5 . (canceled)  
   
   
       6 . A method for manufacturing a semiconductor device, the method comprising the steps of: 
 sandwiching both sides of a heater element by first and second heat sinks so that the heat sinks and the heater element are thermally connected;    molding the heater element together with the first and second heat sinks with a resin mold in such a manner that at least one of the first and second heat sinks is embedded in the resin mold; and    removing a part of the embedded one of the first and second heat sinks together with the resin mold so that the embedded one of the first and second heat sinks is exposed from the resin mold.    
   
   
       7 . The method according to  claim 6 , wherein the part of the embedded one of the first and second heat sinks together with the resin mold is removed in the step of removing by a cutting method or a grinding method.  
   
   
       8 . The method according to  claim 7 , 
 wherein the part of the embedded one of the first and second heat sinks together with the resin mold is removed so that a first heat radiation surface of the first heat sink and a second heat radiation surface of the second heat sink have a degree of parallelism between the first and second heat radiation surfaces equal to or smaller than 0.2 mm, and    wherein the first and second heat radiation surfaces are exposed from the resin mold.    
   
   
       9 . The method according to  claim 8 , 
 wherein the degree of parallelism is equal to or smaller than 0.15 mm.    
   
   
       10 . The method according to  claim 9 , 
 wherein the degree of parallelism is equal to or smaller than 0.1 mm.    
   
   
       11 . The method according to  claim 6 , 
 wherein the step of molding the heater element includes a step of forming a first surface and a second surface of the resin mold,    wherein the first surface of the resin mold covers the one of the first and second heat sinks so that the one of the first and second heat sinks is embedded,    wherein the second surface of the resin mold does not cover the one of the first and second heat sinks,    wherein the first surface of the resin mold is protruded from the second surface of the resin mold to have a step between the first and second surfaces of the resin mold, and    wherein the part of the embedded one of the first and second heat sinks together with the resin mold is removed only from the first surface of the resin mold so that the embedded one of the first and second heat sinks is exposed from the resin mold.    
   
   
       12 . A method for manufacturing a semiconductor device, the method comprising the steps of: 
 sandwiching both sides of a heater element by first and second heat sinks so that the heat sinks and the heater element are thermally connected;    molding the heater element together with the first and second heat sinks with a resin mold in such a manner that at least one of the first and second heat sinks is embedded in the resin mold;    removing a part of the resin mold disposed on the embedded one of the first and second heat sinks so that the embedded one of the first and second heat sinks is exposed from the resin mold; and    refreshing a surface of the exposed one of the first and second heat sinks.    
   
   
       13 . The method according to  claim 12 , wherein the step of refreshing is performed by cutting the surface of the exposed one of the first and second heat sinks.  
   
   
       14 . The method according to  claim 12 , 
 wherein the step of refreshing is performed by grinding the surface of the exposed one of the first and second heat sinks.    
   
   
       15 . The method according to  claim 12 , 
 wherein the surface of the exposed one of the first and second heat sinks is refreshed in the step of refreshing so that a first heat radiation surface of the first heat sink and a second heat radiation surface of the second heat sink have a degree of parallelism between the first and second heat radiation surfaces equal to or smaller than 0.2 mm, and    wherein the first and second heat radiation surfaces are exposed from the resin mold.    
   
   
       16 . The method according to  claim 15 , 
 wherein the degree of parallelism is equal to or smaller than 0.15 mm.    
   
   
       17 . The method according to  claim 16 , 
 wherein the degree of parallelism equal to or smaller than 0.1 mm.    
   
   
       18 . The method according to  claim 12 , 
 wherein the step of molding the heater element includes a step of forming a first surface and a second surface of the resin mold,    wherein the first surface of the resin mold covers the one of the first and second heat sinks so that the one of the first and second heat sinks is embedded,    wherein the second surface of the resin mold does not cover the one of the first and second heat sinks,    wherein the first surface of the resin mold is protruded from the second surface of the resin mold to have a step between the first and second surfaces of the resin mold, and    wherein the part of the resin mold disposed on the embedded one of the first and second heat sinks is removed only from the first surface of the resin mold so that the embedded one of the first and second heat sinks is exposed from the resin mold.    
   
   
       19 . The method according to  claim 12 , 
 wherein the part of the resin mold disposed on the embedded one of the first and second heat sinks is removed by a laser beam cutting method, a water jet cutting method or a shot blast cutting method.    
   
   
       20 . The method according to  claim 19 , 
 wherein the laser beam cutting method is performed by a CO.sub.2 laser or a YAG laser.    
   
   
       21 . The method according to  claim 19 , 
 wherein the water jet cutting method is performed by a water jet.    
   
   
       22 . The method according to  claim 19 , 
 wherein the shot blast cutting method is performed by a sandblast.    
   
   
       23 . The method according to  claim 12 , 
 wherein the part of the resin mold disposed on the embedded one of the first and second heat sinks is removed by a releasing agent,    the method further includes the steps of:    applying the releasing agent on the one of the first and second heat sinks before the step of molding the heater element together with the first and second heat sinks,    wherein the part of the resin mold disposed on the embedded one of the first and second heat sinks through the releasing agent is removed at an interface between the part of the resin mold and the embedded one of the first and second heat sinks.