Inventor · disambiguated record
Takehito Tsukamoto
Also filed as: TSUKAMOTO TAKEHITO
19 granted patents·2 pending applications·252 citations·filing 2000–2017
93Inventor score
Top patents by PatentIndex Score
21 records- 0192US6438281B1Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the sameTOPPAN PRINTING CO LTD·Filed 2000·Granted Aug 20, 2002·119 cites·78 claims
- 0290US6804423B2Optical-electrical wiring board, mounted board and method of manufacturing optical-electrical wiring boardTOPPAN PRINTING CO LTD·Filed 2001·Granted Oct 12, 2004·63 cites·7 claims
- 0382US7050691B2Optical waveguide and method of manufacturing the sameTOPPAN PRINTING CO LTD·Filed 2004·Granted May 23, 2006·23 cites·17 claims
- 0480US6739761B2Optical-electric printed wiring board, printed circuit board, and method of fabricating optical-electric printed wiring boardTOPPAN PRINTING CO LTD·Filed 2001·Granted May 25, 2004·30 cites·18 claims
- 0576US10672928B2Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered bodyDSM IP ASSETS BV·Filed 2017·Granted Jun 2, 2020·2 cites·10 claims
- 0670US8809478B2Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable compositionSAITO MASAKO·Filed 2011·Granted Aug 19, 2014·4 cites·13 claims
- 0769US7584535B2Method of manufacturing multi-layer wiring boardTOPPAN PRINTING CO LTD·Filed 2007·Granted Sep 8, 2009·5 cites·17 claims
- 0862US8319322B2Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor deviceTODA JUNKO·Filed 2011·Granted Nov 27, 2012·2 cites·2 claims
- 0961US8703598B2Manufacturing method of lead frame substrateTOPPAN PRINTING CO LTD·Filed 2013·Granted Apr 22, 2014·1 cites·4 claims
- 1061US8535987B2Method of manufacturing substrate for semiconductor element, and semiconductor deviceMANIWA SUSUMU·Filed 2011·Granted Sep 17, 2013·2 cites·3 claims
- 1157US10056517B2Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered bodyDSM IP ASSETS BV·Filed 2013·Granted Aug 21, 2018·0 cites·12 claims
- 1255US7289713B2Optical waveguide and method of manufacturing the sameTOPPAN PRINTING CO LTD·Filed 2006·Granted Oct 30, 2007·1 cites·4 claims
- 1350US8546940B2Manufacturing method of lead frame substrate and semiconductor apparatusMANIWA SUSUMU·Filed 2009·Granted Oct 1, 2013·0 cites·4 claims
- 1448US8535979B2Method for manufacturing substrate for semiconductor elementTOPPAN PRINTING CO LTD·Filed 2012·Granted Sep 17, 2013·0 cites·1 claims
- 1543US8390105B2Lead frame substrate, manufacturing method thereof, and semiconductor apparatusTODA JUNKO·Filed 2009·Granted Mar 5, 2013·0 cites·3 claims
- 1636US8466547B2Method for manufacturing substrate for semiconductor element, and semiconductor deviceMANIWA SUSUMU·Filed 2011·Granted Jun 18, 2013·0 cites·6 claims
- 1736US2004178492A1Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring boardTOPPAN PRINTING CO LTD·Filed 2004·Application pending·0 cites
- 1835US8558363B2Lead frame substrate and method of manufacturing the same, and semiconductor deviceTSUKAMOTO TAKEHITO·Filed 2011·Granted Oct 15, 2013·0 cites·3 claims
- 1934US2012061809A1Method for manufacturing substrate for semiconductor element, and semiconductor deviceTODA JUNKO·Filed 2011·Application pending·0 cites
- 2032US8304294B2Lead frame substrate and method of manufacturing the sameTSUKAMOTO TAKEHITO·Filed 2011·Granted Nov 6, 2012·0 cites·4 claims
- 2125US8841692B2Lead frame, its manufacturing method, and semiconductor light emitting device using the sameYOSHIOKA OSAMU·Filed 2011·Granted Sep 23, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →