Inventor · disambiguated record
Takuya Tsurume
Also filed as: TSURUME TAKUYA
82 granted patents·3 pending applications·1,248 citations·filing 2003–2016
99Inventor score
Top patents by PatentIndex Score
85 records- 0198US7122445B2Peeling methodSEMICONDUCTOR ENERGY LAB·Filed 2003·Granted Oct 17, 2006·142 cites·37 claims
- 0297US7927971B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Apr 19, 2011·42 cites·21 claims
- 0397US7863188B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Jan 4, 2011·31 cites·20 claims
- 0497US7591863B2Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chipSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Sep 22, 2009·82 cites·25 claims
- 0597US7452786B2Method for manufacturing thin film integrated circuit, and element substrateSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Nov 18, 2008·70 cites·27 claims
- 0696US9006635B2Photodetector circuit and semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Apr 14, 2015·17 cites·21 claims
- 0796US8123896B2Laminating systemWATANABE RYOSUKE·Filed 2005·Granted Feb 28, 2012·38 cites·43 claims
- 0896US7736958B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Jun 15, 2010·40 cites·28 claims
- 0995US8435811B2Method for manufacturing evaporation donor substrate and light-emitting deviceYOKOYAMA KOHEI·Filed 2011·Granted May 7, 2013·14 cites·33 claims
- 1095US7808098B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Oct 5, 2010·27 cites·24 claims
- 1195US7241666B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2004·Granted Jul 10, 2007·63 cites·20 claims
- 1295US7229900B2Semiconductor device, method of manufacturing thereof, and method of manufacturing base materialSEMICONDUCTOR ENERGY LAB·Filed 2004·Granted Jun 12, 2007·72 cites·25 claims
- 1394US9954113B2Transistor including oxide semiconductor, semiconductor device including the transistor, and electronic device including the transistorSEMICONDUCTOR ENERGY LAB·Filed 2016·Granted Apr 24, 2018·11 cites·25 claims
- 1494US8080811B2Method for manufacturing evaporation donor substrate and light-emitting deviceYOKOYAMA KOHEI·Filed 2008·Granted Dec 20, 2011·20 cites·22 claims
- 1594US7820529B2Method for manufacturing integrated circuitSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Oct 26, 2010·27 cites·28 claims
- 1694US7759788B2Semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Jul 20, 2010·30 cites·22 claims
- 1794US7595256B2Semiconductor device, method of manufacturing thereof, and method of manufacturing base materialSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Sep 29, 2009·19 cites·46 claims
- 1894US7510950B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Mar 31, 2009·30 cites·31 claims
- 1994US7476575B2Method for manufacturing thin film integrated circuitSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Jan 13, 2009·25 cites·10 claims
- 2093US8698156B2Laminating systemWATANABE RYOSUKE·Filed 2009·Granted Apr 15, 2014·19 cites·20 claims
- 2193US8436354B2Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor deviceAOKI TOMOYUKI·Filed 2011·Granted May 7, 2013·13 cites·21 claims
- 2293US7968427B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Jun 28, 2011·24 cites·19 claims
- 2393US7785933B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Aug 31, 2010·26 cites·27 claims
- 2492US7728383B2Semiconductor device having a first base, a thin film transistor, and a second baseSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Jun 1, 2010·19 cites·20 claims
- 2591US8372668B2Light-emitting device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2010·Granted Feb 12, 2013·10 cites·14 claims
- 2691US8338931B2Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layersDOZEN YOSHITAKA·Filed 2010·Granted Dec 25, 2012·12 cites·25 claims
- 2791US7632740B2Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Dec 15, 2009·17 cites·16 claims
- 2891US7622361B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Nov 24, 2009·13 cites·15 claims
- 2990US9508619B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Nov 29, 2016·9 cites·20 claims
- 3090US8673739B2Method of manufacturing semiconductor deviceTAKAYAMA TORU·Filed 2011·Granted Mar 18, 2014·8 cites·11 claims
- 3190US7456104B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Nov 25, 2008·15 cites·26 claims
- 3290US7375006B2Peeling methodSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted May 20, 2008·15 cites·27 claims
- 3389US8557699B2Semiconductor device and manufacturing method thereofTSURUME TAKUYA·Filed 2010·Granted Oct 15, 2013·6 cites·10 claims
- 3489US7504317B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Mar 17, 2009·14 cites·13 claims
- 3588US8067294B2Method of manufacturing semiconductor device including protective filmTAKAYAMA TORU·Filed 2009·Granted Nov 29, 2011·10 cites·28 claims
- 3688US7972910B2Manufacturing method of integrated circuit device including thin film transistorSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Jul 5, 2011·11 cites·28 claims
- 3788US7666719B2Peeling methodSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Feb 23, 2010·12 cites·8 claims
- 3888US7465596B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Dec 16, 2008·12 cites·40 claims
- 3987US8749063B2Semiconductor device and method for manufacturing the sameTSURUME TAKUYA·Filed 2006·Granted Jun 10, 2014·10 cites·22 claims
- 4087US8558370B2Semiconductor device with antennaSUGIYAMA EIJI·Filed 2010·Granted Oct 15, 2013·8 cites·32 claims
- 4186US8492246B2Method of manufacturing integrated circuit deviceDAIRIKI KOJI·Filed 2011·Granted Jul 23, 2013·6 cites·35 claims
- 4286US8459561B2Semiconductor device and method for manufacturing the sameAOKI TOMOYUKI·Filed 2008·Granted Jun 11, 2013·13 cites·20 claims
- 4386US7939385B2Method for manufacturing thin film integrated circuit, and element substrateSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted May 10, 2011·9 cites·50 claims
- 4485US7713836B2Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted May 11, 2010·13 cites·25 claims
- 4583US8236629B2Method for manufacturing thin film integrated circuit, and element substrateDOZEN YOSHITAKA·Filed 2011·Granted Aug 7, 2012·5 cites·22 claims
- 4683US8182863B2Deposition method and manufacturing method of light-emitting deviceYAMAZAKI SHUNPEI·Filed 2009·Granted May 22, 2012·6 cites·23 claims
- 4782US9059098B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Jun 16, 2015·3 cites·20 claims
- 4882US8552418B2Semiconductor device and manufacturing method thereofSUGIYAMA EIJI·Filed 2011·Granted Oct 8, 2013·5 cites·23 claims
- 4982US7883989B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Feb 8, 2011·5 cites·20 claims
- 5082US7791153B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Sep 7, 2010·9 cites·11 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →