Inventor · disambiguated record
Takashi Yajima
Also filed as: YAJIMA TAKASHI
28 granted patents·22 pending applications·635 citations·filing 1991–2022
96Inventor score
Top patents by PatentIndex Score
50 records- 0190US5199543AApparatus for and method of discriminating billOKI ELECTRIC IND CO LTD·Filed 1991·Granted Apr 6, 1993·218 cites·13 claims
- 0289US5201395ABill examination deviceOKI ELECTRIC IND CO LTD·Filed 1991·Granted Apr 13, 1993·213 cites·27 claims
- 0388US8460483B2Method for heat treatment of coiled springYAJIMA TAKASHI·Filed 2011·Granted Jun 11, 2013·5 cites·4 claims
- 0487US8243449B2Heat-transporting device and electronic apparatusONIKI KAZUNAO·Filed 2009·Granted Aug 14, 2012·24 cites·11 claims
- 0586US7464591B2Semiconductor acceleration sensorPANASONIC ELEC WORKS CO LTD·Filed 2006·Granted Dec 16, 2008·13 cites·18 claims
- 0685US6840310B2Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling deviceSONY CORP·Filed 2003·Granted Jan 11, 2005·43 cites·26 claims
- 0783US8371334B2Rotary switching valveCKD CORP·Filed 2010·Granted Feb 12, 2013·7 cites·10 claims
- 0881US7971599B2Air-operated valveCKD CORP·Filed 2007·Granted Jul 5, 2011·14 cites·4 claims
- 0974US9145941B2Hollow coil spring and method for manufacturing sameYAJIMA TAKASHI·Filed 2011·Granted Sep 29, 2015·4 cites·3 claims
- 1070US9227300B2Hollow spring and method for manufacturing sameYAJIMA TAKASHI·Filed 2011·Granted Jan 5, 2016·3 cites·12 claims
- 1170USD541905SValveCKD CORP·Filed 2006·Granted May 1, 2007·15 cites·1 claims
- 1270USD463011SValveCKD CORP·Filed 2001·Granted Sep 17, 2002·17 cites·1 claims
- 1367US8765244B2Resin-made inlet pipe and method of producing the pipeTOKAI RUBBER IND LTD·Filed 2012·Granted Jul 1, 2014·2 cites·14 claims
- 1465US11686479B2Encapsulated cleanroom systemAIST·Filed 2021·Granted Jun 27, 2023·0 cites·7 claims
- 1560US9163754B2Resin-made fuel inlet pipe, and method for producing sameTOKAI RUBBER IND LTD·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 1659USD527073SValveCKD CORP·Filed 2004·Granted Aug 22, 2006·9 cites·1 claims
- 1759US5777358AStacked capacitor semiconductor memory device and method for fabricating the sameNEC CORP·Filed 1995·Granted Jul 7, 1998·19 cites·4 claims
- 1855US7834446B2Electronic device and method for coping with electrostatic dischargeTOSHIBA KK·Filed 2009·Granted Nov 16, 2010·2 cites·8 claims
- 1955US2014193597A1Resin fuel tubeTOKAI RUBBER IND LTD·Filed 2014·Application pending·0 cites
- 2055US2011253345A1Heat transportation device production method and heat transportation deviceSONY CHEM & INF DEVICE CORP·Filed 2009·Application pending·0 cites
- 2153US9429255B2Hollow seamless pipe for high-strength springKOBE STEEL LTD·Filed 2013·Granted Aug 30, 2016·0 cites·18 claims
- 2253US6648296B2Hand-operated valve with locking mechanismCKD CORP·Filed 2002·Granted Nov 18, 2003·6 cites·13 claims
- 2351US2025216755A1Image projection deviceKOITO MFG CO LTD·Filed 2022·Application pending·0 cites
- 2449USD549077SPortion of a valveCKD CORP·Filed 2006·Granted Aug 21, 2007·6 cites·1 claims
- 2548US2010157533A1Heat-transporting device, electronic apparatus, and method of producing a heat-transporting deviceSONY CORP·Filed 2009·Application pending·0 cites
- 2648US2010157535A1Heat-transporting device and electronic apparatusSONY CORP·Filed 2009·Application pending·0 cites
- 2748US2015021505A1Lever type switching valveCKD CORP·Filed 2014·Application pending·0 cites
- 2848US2013098494A1Rubber composition for water hose, and water hose obtained using sameTOKAI RUBBER IND LTD·Filed 2012·Application pending·0 cites
- 2948US2011005724A1Heat transport device manufacturing method and heat transport deviceSONY CORP·Filed 2009·Application pending·0 cites
- 3047US10138970B2Coil springMATSUOTO TAKAYUKI·Filed 2011·Granted Nov 27, 2018·2 cites·4 claims
- 3147US2010008043A1Heat-transporting device, electronic apparatus, sealing apparatus, sealing method, and method of producing a heat-transporting deviceSONY CORP·Filed 2009·Application pending·0 cites
- 3246US2010326632A1Phase-change-type heat spreader, flow-path structure, electronic apparatus,and method of producing a phase-change-type heat spreaderSONY CORP·Filed 2008·Application pending·0 cites
- 3346US2007002184A1Video display device and video display methodTOSHIBA KK·Filed 2006·Application pending·0 cites
- 3446US2009323285A1Heat transport device and electronic apparatusSONY CORP·Filed 2009·Application pending·0 cites
- 3546US2010243104A1Resin filler pipe, and resin filler pipe modules each employing the sameTOKAI RUBBER IND LTD·Filed 2010·Application pending·0 cites
- 3644US2010200200A1Heat-transport device, method for manufacturing the same, and electronic deviceSONY CORP·Filed 2010·Application pending·0 cites
- 3743US9056349B2Coil-spring manufacturing apparatusNHK SPRING CO LTD·Filed 2013·Granted Jun 16, 2015·0 cites·3 claims
- 3842US8136581B2Heat transport apparatus and heat transport apparatus manufacturing methodTONOSAKI MINEHIRO·Filed 2003·Granted Mar 20, 2012·2 cites·6 claims
- 3942US2008173834A1Malfunction Prevention Manual ValveCKD CORP·Filed 2005·Application pending·0 cites
- 4041US2010247829A1Resin fuel-supply componentTOKAI RUBBER IND LTD·Filed 2010·Application pending·0 cites
- 4140US7500660B2Vehicle stabilizer for high stressMITSUBISHI STEEL MFG·Filed 2004·Granted Mar 10, 2009·3 cites·2 claims
- 4240US2005092466A1Heat-transport device, method for manufacturing the same, and electronic deviceSONY CORP·Filed 2003·Application pending·0 cites
- 4340US2006232017A1Metal gasket for cylinder headHAMADA YOSHIAKI·Filed 2004·Application pending·0 cites
- 4438US5945739ASemiconductor device having a conductor through an inter-level layer and a spin-on-glass in the inter-level layer with substantially planar upper surfaces of the conductor, the inter-level layer, and the spin-on-glassNEC CORP·Filed 1997·Granted Aug 31, 1999·7 cites·5 claims
- 4538US2010251547A1Method of manufacturing a heat transport device, heat transport device, electronic apparatus, and caulking pinSONY CORP·Filed 2010·Application pending·0 cites
- 4637US2011182035A1Electronic deviceYAJIMA TAKASHI·Filed 2010·Application pending·0 cites
- 4735US2002017704A1Semiconductor device and method of manufactureFiled 2001·Application pending·0 cites
- 4831US9358681B2Work hanging apparatus and work hanging method for hanging work on hanger through movement of work under correctionNHK SPRING CO LTD·Filed 2013·Granted Jun 7, 2016·0 cites·13 claims
- 4930USD535549SPortion of a valveCKD CORP·Filed 2006·Granted Jan 23, 2007·0 cites·1 claims
- 5030US2008047636A1Method of Manufacturing Metal GasketSASAKI HIROMITSU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →