Heat-transport device, method for manufacturing the same, and electronic device

Abstract

A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.

1 - 10 . (canceled)  
   
   
       11 . A heat-transport device comprising: 
 a refrigerant;    an evaporator formed between a glass and a substrate;    a condenser formed between a glass and a substrate;    a liquid passage linking the evaporator and condenser configured to allow the refrigerant to flow from the condenser to the evaporator;    a gas passage linking the evaporator and condenser configured to allow the refrigerant to flow from the evaporator to the condenser; and    a wick being included in one of the evaporator, the condenser, the liquid passage, or the gas passage, wherein the glass and/or the substrate is covered with a stable material.    
   
   
       12 . A heat-transport device according to  claim 11 , wherein the substrate is Si.  
   
   
       13 . A heat-transport device according to  claim 11 , wherein the stable material is selected from the group consisting of SiO 2 , SiN, SiC and combination thereof.  
   
   
       14 . A heat-transport device according to  claim 11 , wherein the refrigerant is a material including hydrogen.  
   
   
       15 . A heat-transport device according to  claim 11 , wherein the wick is covered with the stable material.  
   
   
       16 . A heat-transport device according to  claim 11 , the glass and the substrate is bonded by anodic bonding.  
   
   
       17 . A method for manufacturing a heat-transport device, the method comprising: 
 forming an evaporator between a glass and a substrate;    forming a condenser between a glass and a substrate;    forming a liquid passage and a gas passage between the evaporator and condenser;    forming a wick being in one of the evaporator, the condenser, the liquid passage, or the gas passage; and    coating the glass and/or the substrate with a stable material.    
   
   
       18 . The method of  claim 17 , wherein the substrate is Si.  
   
   
       19 . The method of  claim 17 , wherein the stable material used to coat the glass and/or substrate is selected from the group consisting of SiO 2 , SiN, SiC and combination thereof.  
   
   
       20 . The method of  claim 17 , wherein the refrigerant is a material including hydrogen atom.  
   
   
       21 . The method of  claim 17 , wherein the wick is covered with the stable material.  
   
   
       22 . A method of  claim 17 , wherein the glass and the substrate are bonded by anodic bonding.