Inventor · disambiguated record
Takeshi Yokouchi
Also filed as: YOKOUCHI TAKESHI
9 granted patents·5 pending applications·104 citations·filing 2000–2014
87Inventor score
Top patents by PatentIndex Score
14 records- 0193US7535688B2Method for electrically discharging substrate, substrate processing apparatus and programTOKYO ELECTRON LTD·Filed 2006·Granted May 19, 2009·49 cites·27 claims
- 0290US7896967B2Gas supply system, substrate processing apparatus and gas supply methodTOKYO ELECTRON LTD·Filed 2007·Granted Mar 1, 2011·22 cites·5 claims
- 0384US8790529B2Gas supply system, substrate processing apparatus and gas supply methodHAYASAKA SHINICHIRO·Filed 2011·Granted Jul 29, 2014·11 cites·3 claims
- 0481US8475623B2Substrate processing method, system and programKAISE SEIICHI·Filed 2012·Granted Jul 2, 2013·5 cites·2 claims
- 0580US9732909B2Gas supply methodTOKYO ELECTRON LTD·Filed 2014·Granted Aug 15, 2017·5 cites·4 claims
- 0676US8190281B2Substrate processing apparatus, method for examining substrate processing conditions, and storage mediumYOKOUCHI TAKESHI·Filed 2007·Granted May 29, 2012·9 cites·13 claims
- 0768US8257601B2Substrate processing method, system and programKAISE SEIICHI·Filed 2011·Granted Sep 4, 2012·2 cites·1 claims
- 0858US2007227658A1Control device for controlling substrate processing apparatus and method thereforTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 0956US2011190924A1Control device for controlling substrate processing apparatus and method thereforTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 1049US2006090703A1Substrate processing method, system and programTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 1148US2007199655A1Substrate processing apparatus, method for modifying substrate processing conditions and storage mediumTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 1246US7553773B2Pressure control method and processing deviceTOKYO ELECTRON LTD·Filed 2005·Granted Jun 30, 2009·0 cites·14 claims
- 1345US6908864B2Pressure control method and processing deviceTOKYO ELECTRON LTD·Filed 2000·Granted Jun 21, 2005·1 cites·16 claims
- 1445US2011224818A1Substrate processing apparatus, method for modifying substrate processing conditions and storage mediumTOKYO ELECTRON LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →