Inventor · disambiguated record
Takahiro Yonezawa
Also filed as: YONEZAWA TAKAHIRO
23 granted patents·7 pending applications·439 citations·filing 1992–2025
96Inventor score
Top patents by PatentIndex Score
30 records- 0190US5686353ASemiconductor device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 11, 1997·119 cites·12 claims
- 0285US6017812ABump bonding method and bump bonding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jan 25, 2000·82 cites·3 claims
- 0380US7071090B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 4, 2006·7 cites·5 claims
- 0479US6207549B1Method of forming a ball bond using a bonding capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 27, 2001·45 cites·32 claims
- 0571US6902101B2Bump bonding method apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 7, 2005·15 cites·16 claims
- 0669US6474538B1Bonding apparatus and bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 5, 2002·16 cites·27 claims
- 0768US2025372381A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0867US12354837B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Jul 8, 2025·0 cites·18 claims
- 0965US5457874AMounting apparatus of electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Oct 17, 1995·26 cites·12 claims
- 1064US6667250B2Film substrate treatment apparatus, film substrate treatment method, and film substrate transport methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 23, 2003·9 cites·17 claims
- 1163US6332268B1Method and apparatus for packaging IC chip, and tape-shaped carrier to be used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 25, 2001·21 cites·38 claims
- 1262US5339248AApparatus for mounting electronic component on substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Aug 16, 1994·23 cites·4 claims
- 1361US2025062130A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1460US12451361B2Plasma processing method, plasma processing apparatus, and plasma processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·26 claims
- 1558US6894387B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 17, 2005·6 cites·17 claims
- 1657US7246430B2Electronic component mounting apparatus and electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 24, 2007·6 cites·18 claims
- 1757US5667130AUltrasonic wire bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 16, 1997·24 cites·17 claims
- 1856US2024006188A1Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1955US2025210327A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2055US2023377899A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2155US2023130385A1Method for forming a patternTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2253US2025236951A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2350US6712111B2Bonding method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 30, 2004·4 cites·20 claims
- 2449US8624649B2Delay measuring circuit and delay measuring methodFUJITSU LTD·Filed 2013·Granted Jan 7, 2014·0 cites·6 claims
- 2545US6680221B2Bare chip mounting method and bare chip mounting systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·2 cites·20 claims
- 2645US6619535B1Working method for holding a work object by suctionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 16, 2003·13 cites·10 claims
- 2740US6328196B1Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 11, 2001·8 cites·5 claims
- 2839US5899375ABump bonder with a discard bonding areaMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 4, 1999·8 cites·2 claims
- 2938US6481616B2Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·7 claims
- 3035US5899140ABump levelling method and bump levelling apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 4, 1999·5 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →