Inventor · disambiguated record
Teruaki Chino
Also filed as: CHINO TERUAKI
12 granted patents·5 pending applications·73 citations·filing 2007–2025
89Inventor score
Top patents by PatentIndex Score
17 records- 0189US8536715B2Semiconductor device and method of manufacturing the sameCHINO TERUAKI·Filed 2012·Granted Sep 17, 2013·11 cites·5 claims
- 0286US9485864B2Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing methodSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 1, 2016·10 cites·3 claims
- 0386US8334461B2Wiring board and electronic component deviceTAGUCHI YUICHI·Filed 2008·Granted Dec 18, 2012·14 cites·8 claims
- 0485US8431441B2Semiconductor package and method of manufacturing sameCHINO TERUAKI·Filed 2011·Granted Apr 30, 2013·8 cites·12 claims
- 0584US8293576B2Semiconductor device and method of manufacturing the sameCHINO TERUAKI·Filed 2010·Granted Oct 23, 2012·7 cites·11 claims
- 0683US7928557B2Stacked package and method for manufacturing the packageSHINKO ELECTRIC IND CO·Filed 2007·Granted Apr 19, 2011·12 cites·9 claims
- 0781US8610292B2Resin sealing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2012·Granted Dec 17, 2013·5 cites·4 claims
- 0866US8436471B2Semiconductor package with its surface edge covered by resinCHINO TERUAKI·Filed 2010·Granted May 7, 2013·2 cites·7 claims
- 0966US8368235B2Resin sealing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2010·Granted Feb 5, 2013·2 cites·9 claims
- 1064US8344492B2Semiconductor device and method of manufacturing the same, and electronic apparatusSHINKO ELECTRIC IND CO·Filed 2010·Granted Jan 1, 2013·2 cites·11 claims
- 1164US2025267791A1Wiring substrateSHINKO ELECTRIC IND CO·Filed 2025·Application pending·0 cites
- 1251US2009121341A1Component for semiconductor package and manufacturing method of component for semiconductor packageSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 1348US7985629B2Resin sealing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2009·Granted Jul 26, 2011·0 cites·8 claims
- 1446US9380712B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 28, 2016·0 cites·3 claims
- 1544US2010267208A1Component for semiconductor package and manufacturing method of component for semiconductor packageSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 1644US2008303153A1Semiconductor device, manufacturing method thereof, and semiconductor device productSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 1736US2011062578A1Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →