Inventor · disambiguated record
Terry Davis
Also filed as: DAVIS TERRY · DAVIS TERRY W
15 granted patents·1 pending application·931 citations·filing 1989–2011
95Inventor score
Files withAMKOR TECHNOLOGY INC11CROWLEY SEAN T1DAVIS TERRY W1ILLINOIS TOOL WORKS1JENNINGS MANUFACTURING CO INC1
Top patents by PatentIndex Score
16 records- 0197US6448633B1Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 1999·Granted Sep 10, 2002·258 cites·4 claims
- 0295US6608366B1Lead frame with plated end leadsFiled 2002·Granted Aug 19, 2003·152 cites·21 claims
- 0394US7008825B1Leadframe strip having enhanced testabilityAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 7, 2006·114 cites·21 claims
- 0493US7960818B1Conformal shield on punch QFN semiconductor packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Jun 14, 2011·34 cites·20 claims
- 0591US7183630B1Lead frame with plated end leadsAMKOR TECHNOLOGY INC·Filed 2003·Granted Feb 27, 2007·90 cites·20 claims
- 0691US6841414B1Saw and etch singulation method for a chip packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 11, 2005·87 cites·16 claims
- 0788US8729682B1Conformal shield on punch QFN semiconductor packageDAVIS TERRY W·Filed 2011·Granted May 20, 2014·16 cites·20 claims
- 0888US6611047B2Semiconductor package with singulation creaseAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·58 cites·14 claims
- 0982US7217991B1Fan-in leadframe semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted May 15, 2007·28 cites·19 claims
- 1082US6825062B2Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 30, 2004·26 cites·16 claims
- 1178US7564122B2Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2006·Granted Jul 21, 2009·6 cites·19 claims
- 1274US7473584B1Method for fabricating a fan-in leadframe semiconductor packageAMKOR TECHNOLOGY INC·Filed 2007·Granted Jan 6, 2009·5 cites·20 claims
- 1372US7057280B2Leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·14 cites·18 claims
- 1461US4907506AMethod and apparatus for controlling spring rate and leverage in a screen printing deviceJENNINGS MANUFACTURING CO INC·Filed 1989·Granted Mar 13, 1990·13 cites·31 claims
- 1554US5636745ATray for a component and an apparatus for accurately placing a component within the trayILLINOIS TOOL WORKS·Filed 1994·Granted Jun 10, 1997·30 cites·20 claims
- 1637US2007176287A1Thin integrated circuit device packages for improved radio frequency performanceCROWLEY SEAN T·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →