Inventor · disambiguated record
Terunao Hanaoka
Also filed as: HANAOKA TERUNAO
35 granted patents·5 pending applications·867 citations·filing 2000–2017
97Inventor score
Top patents by PatentIndex Score
40 records- 0198US6667551B2Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavitySEIKO EPSON CORP·Filed 2001·Granted Dec 23, 2003·233 cites·29 claims
- 0297US6720661B2Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2001·Granted Apr 13, 2004·147 cites·15 claims
- 0395US6852621B2Semiconductor device and manufacturing method therefor, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Feb 8, 2005·82 cites·19 claims
- 0492US7294933B2Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2007·Granted Nov 13, 2007·21 cites·14 claims
- 0592US7102219B2Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Sep 5, 2006·56 cites·3 claims
- 0689US6962865B2Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Nov 8, 2005·44 cites·20 claims
- 0789US6707153B2Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing sameSEIKO EPSON CORP·Filed 2001·Granted Mar 16, 2004·75 cites·20 claims
- 0888US9709800B2Electro-optical device, manufacturing method thereof, and electronic apparatusSEIKO EPSON CORP·Filed 2016·Granted Jul 18, 2017·4 cites·4 claims
- 0985US6642615B2Semiconductor device and method of manufacturing the same, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2001·Granted Nov 4, 2003·34 cites·13 claims
- 1084US9465210B1Electro-optical device, method of manufacturing electro-optical device, and electronic apparatusSEIKO EPSON CORP·Filed 2016·Granted Oct 11, 2016·3 cites·17 claims
- 1184US6940160B1Semiconductor device and method of manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Sep 6, 2005·42 cites·18 claims
- 1283US6958527B2Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the sameSEIKO EPSON CORP·Filed 2003·Granted Oct 25, 2005·31 cites·17 claims
- 1381US7176572B2Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Feb 13, 2007·26 cites·15 claims
- 1474US7462937B2Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Dec 9, 2008·6 cites·8 claims
- 1573US8631701B2Sensor device, motion sensor, and electronic deviceCHIBA SEIICHI·Filed 2011·Granted Jan 21, 2014·7 cites·19 claims
- 1667US7183645B2Semiconductor device with external terminal joined to concave portion of wiring layerSEIKO EPSON CORP·Filed 2004·Granted Feb 27, 2007·14 cites·12 claims
- 1767US6897127B2Semiconductor device, method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted May 24, 2005·13 cites·20 claims
- 1862US10156779B2Electro-optical device, method of manufacturing electro-optical device, and electronic apparatusSEIKO EPSON CORP·Filed 2017·Granted Dec 18, 2018·0 cites·7 claims
- 1961US9443993B2Spectroscopic sensor and method for manufacturing sameSEIKO EPSON CORP·Filed 2014·Granted Sep 13, 2016·0 cites·5 claims
- 2059US9885945B2Electro-optical device, method of manufacturing electro-optical device, and electronic apparatusSEIKO EPSON CORP·Filed 2016·Granted Feb 6, 2018·0 cites·16 claims
- 2159US7714410B2Semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted May 11, 2010·1 cites·5 claims
- 2257US10054787B2Electro-optical device, manufacturing method thereof, and electronic apparatusSEIKO EPSON CORP·Filed 2017·Granted Aug 21, 2018·0 cites·3 claims
- 2356US10859814B2Electro-optical device, manufacturing method thereof, and electronic apparatusSEIKO EPSON CORP·Filed 2017·Granted Dec 8, 2020·0 cites·7 claims
- 2455US7067929B2Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2004·Granted Jun 27, 2006·7 cites·30 claims
- 2554US6924558B2Semiconductor device and method of fabricating the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted Aug 2, 2005·5 cites·28 claims
- 2653US7057282B2Semiconductor device and method for manufacturing the same, circuit board and electronic equipmentSEIKO EPSON CORP·Filed 2004·Granted Jun 6, 2006·5 cites·12 claims
- 2752US7670859B2Semiconductor device and method for manufacturing the sameSEIKO EPSON CORP·Filed 2006·Granted Mar 2, 2010·1 cites·6 claims
- 2852US2016282609A1Electro-optical device, manufacturing method thereof, and electronic apparatusSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 2951US8749001B2Electronic component, electronic device, and method of manufacturing the electronic componentHANAOKA TERUNAO·Filed 2011·Granted Jun 10, 2014·1 cites·14 claims
- 3051US6806176B2Semiconductor device and method of manufacturing the same, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted Oct 19, 2004·3 cites·1 claims
- 3148US2014103467A1Sensor device, motion sensor, and electronic deviceSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 3247US7605464B2Semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Oct 20, 2009·0 cites·5 claims
- 3347US7144760B2Semiconductor device, method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Dec 5, 2006·2 cites·14 claims
- 3447US7009306B2Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Mar 7, 2006·2 cites·20 claims
- 3545US6894394B2Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2004·Granted May 17, 2005·2 cites·20 claims
- 3645US2008174026A1Semiconductor deviceSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 3744US2013255387A1Vibration device and method for manufacturing vibration deviceSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 3843US2007090356A1Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 3942US9748115B2Electronic component and method for producing the sameSEIKO EPSON CORP·Filed 2015·Granted Aug 29, 2017·0 cites·8 claims
- 4042US7459637B2Semiconductor device, manufacturing method thereof, circuit board, and electronic applianceSEIKO EPSON CORP·Filed 2005·Granted Dec 2, 2008·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →