Inventor · disambiguated record
Te-Chih Huang
Also filed as: HUANG TE-CHIH
24 granted patents·6 pending applications·160 citations·filing 2007–2024
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8ASML NETHERLANDS BV6TAIWAN SEMICONDUCTOR MFG5LIU GEORGE2TUNG CHIUN-YEN2
Top patents by PatentIndex Score
30 records- 0196US8837810B2System and method for alignment in semiconductor device fabricationCHEN YEN-LIANG·Filed 2012·Granted Sep 16, 2014·82 cites·20 claims
- 0294US9903823B2Metrology method and apparatusASML NETHERLANDS BV·Filed 2015·Granted Feb 27, 2018·10 cites·20 claims
- 0390US8431291B2Intensity selective exposure photomaskLIU GEORGE·Filed 2011·Granted Apr 30, 2013·5 cites·16 claims
- 0486US10180628B2Method of determining critical-dimension-related properties, inspection apparatus and device manufacturing methodASML NETHERLANDS BV·Filed 2014·Granted Jan 15, 2019·4 cites·21 claims
- 0586US8755045B2Detecting method for forming semiconductor deviceLIN JYUH-FUH·Filed 2012·Granted Jun 17, 2014·15 cites·19 claims
- 0683US8179536B2Measurement of overlay offset in semiconductor processingHUANG TE-CHIH·Filed 2010·Granted May 15, 2012·6 cites·20 claims
- 0781US10162272B2Metrology method and apparatus, substrates for use in such methods, lithographic system and device manufacturing methodASML NETHERLANDS BV·Filed 2016·Granted Dec 25, 2018·2 cites·23 claims
- 0881USRE45943EMeasurement of overlay offset in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·3 cites·23 claims
- 0981US7796249B2Mask haze early detectionTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Sep 14, 2010·5 cites·20 claims
- 1080US10073357B2Measuring a process parameter for a manufacturing process involving lithographyASML NETHERLANDS BV·Filed 2015·Granted Sep 11, 2018·2 cites·13 claims
- 1178US12196687B2Method for inspecting pattern defectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 14, 2025·1 cites·20 claims
- 1278US10915017B2Multi-function overlay marks for reducing noise and extracting focus and critical dimension informationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·2 cites·20 claims
- 1377US12055860B2Multi-function overlay marks for reducing noise and extracting focus and critical dimension informationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1477US10608830B2Power over fiber enabled sensor systemMH GOPOWER COMPANY LTD·Filed 2018·Granted Mar 31, 2020·7 cites·39 claims
- 1576US8003303B2Intensity selective exposure method and apparatusTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Aug 23, 2011·4 cites·18 claims
- 1675US9201022B2Extraction of systematic defectsHU JIA-RUI·Filed 2011·Granted Dec 1, 2015·6 cites·20 claims
- 1774US7858404B2Measurement of overlay offset in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 28, 2010·3 cites·9 claims
- 1873US11835864B2Multi-function overlay marks for reducing noise and extracting focus and critical dimension informationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1972US9026957B2Method of defining an intensity selective exposure photomaskTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 5, 2015·1 cites·15 claims
- 2070US11320745B2Measuring a process parameter for a manufacturing process involving lithographyASML NETHERLANDS BV·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2170US8673520B2Intensity selective exposure photomaskLIU GEORGE·Filed 2011·Granted Mar 18, 2014·1 cites·19 claims
- 2269US10795270B2Methods of defect inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 6, 2020·1 cites·19 claims
- 2363US11448975B2Multi-function overlay marks for reducing noise and extracting focus and critical dimension informationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·20 claims
- 2461US11624985B2Methods of defect inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 2558US2016005906A1Optoelectronic Thermal Interfaces for 3-Dimensional Billet Devices, Including Vertical Multijunction Photovoltaic Receivers Using Heat Sinked Anode/Billet/Cathode For High Intensity Beaming and Wireless Power TransmissionTUNG CHIUN-YEN·Filed 2014·Application pending·0 cites
- 2658US2016005902A1Direct Thermal Path Heat Sinking Using Fins Formed From Energy Conversion Device Components, Including Subcomponents of Vertical Multijunction Photovoltaic Receivers Used For High Intensity Beaming and Wireless Power TransmissionTUNG CHIUN-YEN·Filed 2014·Application pending·0 cites
- 2757US2019018326A1Measuring a Process Parameter for a Manufacturing Process Involving LithographyASML NETHERLANDS BV·Filed 2018·Application pending·0 cites
- 2857US2025093278A1Method for inspecting pattern defectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2950US2015000729A1Solar cell with passivation layer and manufacturing method thereofMH SOLAR COMPANY LTD·Filed 2014·Application pending·0 cites
- 3025US2016126382A1Energy conversion device with multiple voltage outputs and power transistor module using the sameMH GOPOWER CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →