Inventor · disambiguated record
Terukazu Ihara
Also filed as: IHARA TERUKAZU
15 granted patents·13 pending applications·20 citations·filing 2010–2023
88Inventor score
Top patents by PatentIndex Score
28 records- 0181US9226395B2Printed circuit board and method of manufacturing the sameIHARA TERUKAZU·Filed 2012·Granted Dec 29, 2015·6 cites·10 claims
- 0280US9451704B2Suspension board assembly sheet with circuits and method for manufacturing the sameNITTO DENKO CORP·Filed 2013·Granted Sep 20, 2016·4 cites·7 claims
- 0375US8658906B2Printed circuit board assembly sheet and method for manufacturing the sameISHII JUN·Filed 2011·Granted Feb 25, 2014·2 cites·14 claims
- 0471US8477507B2Suspension board assembly sheet with circuits and method for manufacturing the sameIHARA TERUKAZU·Filed 2010·Granted Jul 2, 2013·2 cites·11 claims
- 0569US9763334B2Suspension board with circuit and method of manufacturing the sameNITTO DENKO CORP·Filed 2014·Granted Sep 12, 2017·2 cites·16 claims
- 0667US8897024B2Method for manufacturing a suspension board assembly sheet with circuitsNITTO DENKO CORP·Filed 2013·Granted Nov 25, 2014·1 cites·2 claims
- 0767US8310668B2Producing method of wired circuit boardIHARA TERUKAZU·Filed 2010·Granted Nov 13, 2012·2 cites·3 claims
- 0867US2025041808A1Separation functional layer, separation membrane, and method for manufacturing separation functional layerNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0960US9642262B2Method of manufacturing a printed circuit board assembly sheetNITTO DENKO CORP·Filed 2013·Granted May 2, 2017·0 cites·12 claims
- 1058US10420224B2Printed circuit board assembly sheet and method for manufacturing the sameNITTO DENKO CORP·Filed 2017·Granted Sep 17, 2019·0 cites·8 claims
- 1158US9313880B2Printed circuit board, printed circuit board assembly sheet and method of manufacturing the sameIHARA TERUKAZU·Filed 2011·Granted Apr 12, 2016·1 cites·6 claims
- 1257US2024399296A1Gas separation system and method for separating gas mixtureNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1357US2024350970A1Separation functional layer, separation membrane, and method for manufacturing separation functional layerNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1456US2025177912A1Acidic gas recovery system and recovery methodNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 1554US2023147963A1Formate production method and formate production systemNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1653US12337278B2Carbon-dioxide capture and treatment system and carbon-dioxide negative emissions plantNITTO DENKO CORP·Filed 2021·Granted Jun 24, 2025·0 cites·18 claims
- 1752US2022340420A1Hydrogen gas production method and hydrogen gas production systemNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1851US2021261741A1Method for producing ionic liquid-containing structure, and ionic liquid containing structureNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 1949US2020362140A1Method for producing ionic liquid-containing structure, and ionic liquid-containing structureNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 2049US2023294039A1Gas separation system and method for separating gas mixtureNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2148US9648726B2Suspension board assembly sheet with circuits and manufacturing method of the sameNITTO DENKO CORP·Filed 2014·Granted May 9, 2017·0 cites·10 claims
- 2247US10264684B2Conductivity inspection method of printed circuit board and manufacturing method of printed circuit boardNITTO DENKO CORP·Filed 2014·Granted Apr 16, 2019·0 cites·3 claims
- 2347US8797831B2Suspension board with circuitNITTO DENKO CORP·Filed 2013·Granted Aug 5, 2014·0 cites·3 claims
- 2445US2022161195A1Ionic liquid-containing structureNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2544US2021394129A1Separation membrane and membrane separation methodNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 2640US2019314768A1Separation membrane and laminateNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 2739US2018024057A1Measurement deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2838US8316532B2Method of producing a wired circuit boardTOYODA YOSHIHIRO·Filed 2010·Granted Nov 27, 2012·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →