Inventor · disambiguated record
Teckgyu Kang
Also filed as: KANG TECKGYU · Kang Teckgyu (Terry)
36 granted patents·7 pending applications·122 citations·filing 2012–2025
96Inventor score
Top patents by PatentIndex Score
43 records- 0197US10025047B1Integration of silicon photonics IC for high data rateGOOGLE INC·Filed 2017·Granted Jul 17, 2018·39 cites·14 claims
- 0296US10548240B1Cooling electronic devices in a data centerGOOGLE LLC·Filed 2019·Granted Jan 28, 2020·24 cites·20 claims
- 0394US11832396B2Cooling electronic devices in a data centerGOOGLE LLC·Filed 2020·Granted Nov 28, 2023·3 cites·22 claims
- 0494US10548239B1Cooling electronic devices in a data centerGOOGLE LLC·Filed 2018·Granted Jan 28, 2020·12 cites·22 claims
- 0594US9425171B1Removable substrate for controlling warpage of an integrated circuit packageNVIDIA CORP·Filed 2015·Granted Aug 23, 2016·13 cites·20 claims
- 0690US10681846B2Cooling electronic devices in a data centerGOOGLE LLC·Filed 2018·Granted Jun 9, 2020·5 cites·28 claims
- 0790US10083920B1Package stiffener for protecting semiconductor dieGOOGLE LLC·Filed 2018·Granted Sep 25, 2018·6 cites·20 claims
- 0890US2025349802A1Backside Integrated Voltage Regulator For Integrated CircuitsGOOGLE LLC·Filed 2025·Application pending·0 cites
- 0988US12278217B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2024·Granted Apr 15, 2025·0 cites·15 claims
- 1088US11276668B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2020·Granted Mar 15, 2022·2 cites·20 claims
- 1187US11784215B2Deep trench capacitors embedded in package substrateGOOGLE LLC·Filed 2020·Granted Oct 10, 2023·2 cites·21 claims
- 1286US12327817B2ASIC package with photonics and vertical power deliveryGOOGLE LLC·Filed 2024·Granted Jun 10, 2025·0 cites·18 claims
- 1386US10257921B1Embedded air gap transmission linesGOOGLE LLC·Filed 2018·Granted Apr 9, 2019·5 cites·18 claims
- 1484US11990386B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2021·Granted May 21, 2024·1 cites·18 claims
- 1584US2025264677A1Asic Package With Photonics And Vertical Power DeliveryGOOGLE LLC·Filed 2025·Application pending·0 cites
- 1683US12394756B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2023·Granted Aug 19, 2025·0 cites·9 claims
- 1783US12315860B2Integrated circuit package for high bandwidth memoryGOOGLE LLC·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 1883US12243802B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2024·Granted Mar 4, 2025·0 cites·7 claims
- 1981US10658322B2High bandwidth memory package for high performance processorsGOOGLE LLC·Filed 2019·Granted May 19, 2020·2 cites·9 claims
- 2080US10964625B2Device and method for direct liquid cooling via metal channelsGOOGLE LLC·Filed 2019·Granted Mar 30, 2021·3 cites·31 claims
- 2176US11990461B2Integrated circuit package for high bandwidth memoryGOOGLE LLC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2276US11978721B2ASIC package with photonics and vertical power deliveryGOOGLE LLC·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 2376US11830855B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2022·Granted Nov 28, 2023·0 cites·10 claims
- 2475US12274079B2Deep trench capacitors embedded in package substrateGOOGLE LLC·Filed 2023·Granted Apr 8, 2025·0 cites·23 claims
- 2573US10032696B2Chip package using interposer substrate with through-silicon viasNVIDIA CORP·Filed 2012·Granted Jul 24, 2018·3 cites·13 claims
- 2670US11488944B2Integrated circuit package for high bandwidth memoryGOOGLE LLC·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 2770US10515920B2High bandwidth memory package for high performance processorsGOOGLE LLC·Filed 2018·Granted Dec 24, 2019·1 cites·10 claims
- 2870US10468359B2Package stiffener for protecting semiconductor dieGOOGLE LLC·Filed 2018·Granted Nov 5, 2019·1 cites·18 claims
- 2969US12476227B2Socket to support high performance multi-die ASICsGOOGLE LLC·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 3068US11967538B2Three dimensional IC package with thermal enhancementGOOGLE LLC·Filed 2021·Granted Apr 23, 2024·0 cites·17 claims
- 3166US11264295B2Integrated circuit substrate for containing liquid adhesive bleed-outGOOGLE LLC·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 3264US11264358B2ASIC package with photonics and vertical power deliveryGOOGLE LLC·Filed 2019·Granted Mar 1, 2022·0 cites·18 claims
- 3356US12051679B2Backside interconnection interface die for integrated circuits packageGOOGLE LLC·Filed 2020·Granted Jul 30, 2024·0 cites·17 claims
- 3455US11955406B2Temperature control element utilized in device die packagesGOOGLE LLC·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 3555US10818567B2Integrated circuit substrate for containing liquid adhesive bleed-outGOOGLE LLC·Filed 2019·Granted Oct 27, 2020·0 cites·9 claims
- 3653US2023343768A1Optical Communication for Memory Disaggregation in High Performance ComputingGOOGLE LLC·Filed 2022·Application pending·0 cites
- 3752US2024036278A13D High Bandwidth Memory and Optical Connectivity StackingGOOGLE LLC·Filed 2022·Application pending·0 cites
- 3850US10930592B2Wafer level fan-out application specific integrated circuit bridge memory stackGOOGLE LLC·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 3949US10896873B2Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applicationsGOOGLE LLC·Filed 2019·Granted Jan 19, 2021·0 cites·20 claims
- 4046US9659815B2System, method, and computer program product for a cavity package-on-package structureNVIDIA CORP·Filed 2014·Granted May 23, 2017·0 cites·20 claims
- 4146US2016379939A1Removable substrate for controlling warpage of an integrated circuit packageNVIDIA CORP·Filed 2016·Application pending·0 cites
- 4241US2014151892A1Three dimensional through-silicon via constructionNVIDIA CORP·Filed 2012·Application pending·0 cites
- 4339US2018299628A1Integration of silicon photonics ic for high data rateGOOGLE LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →