Inventor · disambiguated record
Teruaki Kasai
Also filed as: KASAI TERUAKI
11 granted patents·2 pending applications·184 citations·filing 1980–2019
90Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD6HAJI HIROSHI2PANASONIC CORP2PANASONIC IP MAN CO LTD2NISSAN MOTOR1
Top patents by PatentIndex Score
13 records- 0183US8192578B2Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing methodHAJI HIROSHI·Filed 2006·Granted Jun 5, 2012·10 cites·16 claims
- 0280US8614118B2Component bonding method, component laminating method and bonded component structureHAJI HIROSHI·Filed 2007·Granted Dec 24, 2013·11 cites·6 claims
- 0379US7306695B2Apparatus and method for picking up semiconductor chipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 11, 2007·24 cites·4 claims
- 0479US5601229AConductive metal ball attaching apparatus and method, and bump forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Feb 11, 1997·75 cites·24 claims
- 0577US7632374B2Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used thereforPANASONIC CORP·Filed 2003·Granted Dec 15, 2009·21 cites·9 claims
- 0676US6390351B1Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 21, 2002·25 cites·25 claims
- 0765US8897328B2Semiconductor laser apparatus and method for manufacturing samePANASONIC CORP·Filed 2014·Granted Nov 25, 2014·2 cites·20 claims
- 0852US4385529AFoot-operated parking brake lever assemblyNISSAN MOTOR·Filed 1980·Granted May 31, 1983·14 cites·8 claims
- 0942US11133644B2Semiconductor laser devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·6 claims
- 1041US2009000109A1Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting ApparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 1141US2009202333A1Electronic component pickup method, electronic component mounting method and electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 1238US11228159B2Semiconductor laser devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·9 claims
- 1328US6237219B1Method of mounting conductive ballMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 29, 2001·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →