Inventor · disambiguated record
Teruhiko Kodama
Also filed as: KODAMA TERUHIKO
18 granted patents·4 pending applications·17 citations·filing 2015–2025
89Inventor score
Files withTOKYO ELECTRON LTD22
Top patents by PatentIndex Score
22 records- 0190US11554389B2Substrate cleaning apparatus and substrate cleaning methodTOKYO ELECTRON LTD·Filed 2021·Granted Jan 17, 2023·2 cites·9 claims
- 0288US11693319B2Substrate processing method, substrate processing apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2021·Granted Jul 4, 2023·1 cites·19 claims
- 0387US10074542B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Sep 11, 2018·6 cites·8 claims
- 0481US2025367701A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0580US9711419B2Substrate backside texturingTOKYO ELECTRON LTD·Filed 2015·Granted Jul 18, 2017·3 cites·16 claims
- 0679US9601394B2Substrate processing apparatus, substrate processing method and memory mediumTOKYO ELECTRON LTD·Filed 2015·Granted Mar 21, 2017·2 cites·5 claims
- 0778US12230515B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Granted Feb 18, 2025·0 cites·4 claims
- 0873US10840079B2Substrate processing apparatus, substrate processing method and storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted Nov 17, 2020·2 cites·17 claims
- 0972US11139182B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Oct 5, 2021·1 cites·12 claims
- 1071US12409470B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Granted Sep 9, 2025·0 cites·17 claims
- 1170US2025321490A1Substrate treatment method, substrate treatment apparatus, and computer storage mediumTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1268US11887869B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Jan 30, 2024·0 cites·4 claims
- 1365US11287798B2Substrate processing capable of suppressing a decrease in throughput while reducing the impact on exposure treatment caused by warping of a substrateTOKYO ELECTRON LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 1461US2025050377A1Hydrophobization treatment apparatus, hydrophobization treatment method, and computer storage mediumTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1556US10528028B2Substrate processing apparatus, substrate processing method and memory mediumTOKYO ELECTRON LTD·Filed 2017·Granted Jan 7, 2020·0 cites·20 claims
- 1653US2023197475A1Substrate processing apparatus, substrate processing method and storage mediumTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1750US11532487B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Dec 20, 2022·0 cites·12 claims
- 1849US10649335B2Substrate processing apparatus, substrate processing method and storage mediumTOKYO ELECTRON LTD·Filed 2016·Granted May 12, 2020·0 cites·14 claims
- 1948US9972512B2Liquid processing method, memory medium and liquid processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted May 15, 2018·0 cites·20 claims
- 2044US9786488B2Liquid processing method, memory medium and liquid processing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Oct 10, 2017·0 cites·15 claims
- 2143US11126086B2Substrate treatment apparatus, substrate treatment method, and computer storage mediumTOKYO ELECTRON LTD·Filed 2018·Granted Sep 21, 2021·0 cites·18 claims
- 2240US12491600B2Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Dec 9, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →