Inventor · disambiguated record
Teck-Chong Lee
Also filed as: LEE TECK-CHONG
40 granted patents·12 pending applications·112 citations·filing 2006–2024
96Inventor score
Files withADVANCED SEMICONDUCTOR ENG42CHEN CHIEN-HUA5ASE SHANGHAI INC1CHAO SHIN-HUA1INC ADVANCED SEMICONDUCTOR ENGINEERING1
Top patents by PatentIndex Score
52 records- 0197US9837352B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 5, 2017·41 cites·22 claims
- 0293US11742324B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 29, 2023·2 cites·12 claims
- 0391US8853819B2Semiconductor structure with passive element network and manufacturing method thereofCHEN CHIEN-HUA·Filed 2011·Granted Oct 7, 2014·16 cites·20 claims
- 0490US11133423B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·6 cites·18 claims
- 0586US11011496B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·3 cites·17 claims
- 0685US11508655B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·2 cites·18 claims
- 0783US11894317B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 6, 2024·2 cites·10 claims
- 0883US11887928B2Package structure with interposer encapsulated by an encapsulantADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 30, 2024·1 cites·7 claims
- 0983US10475718B2Semiconductor device package comprising a dielectric layer with built-in inductorADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·5 cites·18 claims
- 1081US12166009B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 1177US11276620B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·2 cites·20 claims
- 1275US10490341B2Electrical deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 26, 2019·2 cites·22 claims
- 1375US9577027B2Semiconductor device and process of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Feb 21, 2017·2 cites·17 claims
- 1475US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 1575US2025125209A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1673US7547575B2Two-stage die-bonding method for simultaneous die-bonding of multiple diesADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 16, 2009·7 cites·6 claims
- 1771US11605877B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 14, 2023·1 cites·20 claims
- 1868US12176259B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 24, 2024·0 cites·3 claims
- 1968US11637172B2Semiconductor device packages including an inductor and a capacitorADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 25, 2023·0 cites·14 claims
- 2068US11373967B2Semiconductor device package and method for packaging the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 28, 2022·1 cites·13 claims
- 2168US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 2267US8415790B2Semiconductor package having passive device and method for making the sameCHEN CHIEN-HUA·Filed 2010·Granted Apr 9, 2013·2 cites·16 claims
- 2367US8368173B2Semiconductor package and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·2 cites·8 claims
- 2466US12300602B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 13, 2025·0 cites·17 claims
- 2566US8274133B2Semiconductor package and method for making the sameCHEN CHIEN-HUA·Filed 2010·Granted Sep 25, 2012·2 cites·13 claims
- 2664US11764311B2Optical device and electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 2764US11495572B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 2862US11515241B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 29, 2022·0 cites·18 claims
- 2960US2010239857A1Structure of embedded-trace substrate and method of manufacturing the sameTARNG SHIN-LUH·Filed 2009·Application pending·0 cites
- 3059US2013122216A1Structure of embedded-trace substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2013·Application pending·0 cites
- 3155US10950531B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 3255US7581666B2Wire-bonding method for wire-bonding apparatusADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 1, 2009·1 cites·6 claims
- 3354US10833144B2Semiconductor device packages including an inductor and a capacitorADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Nov 10, 2020·0 cites·20 claims
- 3454US10741523B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 11, 2020·0 cites·18 claims
- 3553US11621220B2Assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 4, 2023·0 cites·17 claims
- 3652US9929132B2Semiconductor device and process of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 27, 2018·0 cites·20 claims
- 3750US11855034B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 26, 2023·0 cites·13 claims
- 3850US10903561B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 26, 2021·0 cites·19 claims
- 3950US8778769B2Semiconductor package having passive device and method for making the sameCHEN CHIEN-HUA·Filed 2012·Granted Jul 15, 2014·0 cites·10 claims
- 4049US2013102122A1Semiconductor package and method for making the sameCHEN CHIEN-HUA·Filed 2012·Application pending·0 cites
- 4146US11545427B2Capacitor bank structure and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 3, 2023·0 cites·1 claims
- 4245US10861840B2Integrated passive component and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 8, 2020·0 cites·29 claims
- 4344US2020075571A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 4441US2008044931A1Packaging substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4541US2014252547A1Semiconductor device having integrated passive device and process for manufacturing the sameINC ADVANCED SEMICONDUCTOR ENGINEERING·Filed 2013·Application pending·0 cites
- 4640US2020381345A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 4740US2008035706A1Wire-bonding apparatus and wire-bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4836US8059422B2Thermally enhanced package structureTONG HO-MING·Filed 2008·Granted Nov 15, 2011·0 cites·14 claims
- 4936US2018138113A1Semiconductor system and device package including interconnect structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
- 5034US9881917B2Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jan 30, 2018·0 cites·16 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →