Inventor · disambiguated record
Teck Sim Lee
Also filed as: LEE TECK SIM
31 granted patents·14 pending applications·68 citations·filing 2008–2025
95Inventor score
Files withINFINEON TECHNOLOGIES AG22INFINEON TECHNOLOGIES AUSTRIA AG14INFINEON TECHNOLOGIES AUSTRIA5CHONG CHOOI MEI1GOLLER BERND1
Top patents by PatentIndex Score
45 records- 0194US11876028B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 0288US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 0383US9373566B2High power electronic component with multiple leadframesINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted Jun 21, 2016·6 cites·18 claims
- 0480US12094793B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0580US11676881B2Semiconductor package, semiconductor assembly and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·1 cites·20 claims
- 0680US10373897B2Semiconductor devices with improved thermal and electrical performanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·4 cites·8 claims
- 0780US9263563B2Semiconductor device packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Feb 16, 2016·6 cites·9 claims
- 0879US11600547B2Semiconductor package with expanded heat spreaderINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Mar 7, 2023·3 cites·20 claims
- 0978US2024395646A1Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1076US7732937B2Semiconductor package with mold lock ventINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 8, 2010·7 cites·6 claims
- 1175US10147703B2Semiconductor package for multiphase circuitry deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 4, 2018·3 cites·23 claims
- 1272US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 1370USD609191SPackage for electronic deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Feb 2, 2010·17 cites·1 claims
- 1466US10727151B2Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 28, 2020·2 cites·13 claims
- 1566US9230880B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 5, 2016·1 cites·20 claims
- 1664US9972576B2Semiconductor chip package comprising side wall markingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted May 15, 2018·1 cites·16 claims
- 1760US9324642B2Method of electrically isolating shared leads of a lead frame stripINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 26, 2016·2 cites·20 claims
- 1860US8466009B2Method of fabricating a semiconductor package with mold lock openingGOLLER BERND·Filed 2010·Granted Jun 18, 2013·2 cites·14 claims
- 1960US2025285947A1Semiconductor package with combined lead frame and clip frameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2060US2025286011A1Semiconductor package with hybrid interconnect clipINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2159US10083899B2Semiconductor package with heat slug and rivet free die attach areaINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
- 2259US2024347427A1Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2358US7821141B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 26, 2010·1 cites·29 claims
- 2457US11942383B2Linear spacer for spacing a carrier of a packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 26, 2024·0 cites·15 claims
- 2556US2024312936A1Power semiconductor package including a passive electronic component and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2653US2024087995A1Power semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2752US11348866B2Package and lead frame design for enhanced creepage and clearanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 2852US2023361009A1Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2952US2025323138A1Application board and a semiconductor package mounted thereon for reducing creepage currentsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 3050US2018158758A1Leadframe and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Application pending·0 cites
- 3149US11804424B2Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 3249US11355424B2Multi-chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 3347US9035437B2Packaged device comprising non-integer lead pitches and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted May 19, 2015·0 cites·18 claims
- 3446US2022108949A1Semiconductor packages including a u-shaped railINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 3546US2016056092A1Leadframe and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2015·Application pending·0 cites
- 3644US10699978B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 30, 2020·0 cites·18 claims
- 3743US10290567B2Transistor package with three-terminal clipINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 14, 2019·0 cites·19 claims
- 3841US2014210061A1Chip arrangement and chip packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 3940US8664753B2Semiconductor device with protruding component portion and method of packagingLEE TECK SIM·Filed 2009·Granted Mar 4, 2014·0 cites·25 claims
- 4037US9991183B2Semiconductor component having inner and outer semiconductor component housingsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Jun 5, 2018·0 cites·20 claims
- 4137US2013154123A1Semiconductor Device and Fabrication MethodPOH YONG CHERN·Filed 2011·Application pending·0 cites
- 4236US9978671B2Power semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted May 22, 2018·0 cites·20 claims
- 4334US8836101B2Multi-chip semiconductor packages and assembly thereofCHONG CHOOI MEI·Filed 2010·Granted Sep 16, 2014·0 cites·16 claims
- 4434US2016365296A1Electronic Devices with Increased Creepage DistancesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 4531US10037934B2Semiconductor chip package having contact pins at short side edgesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jul 31, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →