Inventor · disambiguated record
Tengzhou Ma
Also filed as: MA TENGZHOU
0 granted patents·10 pending applications·0 citations·filing 2021–2025
Top patents by PatentIndex Score
10 records- 0157US2024360557A1Halide and organic precursors for metal depositionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0254US2021313503A1Functionally graded organic thermoelectric materials and uses thereofUNIV CHICAGO·Filed 2021·Application pending·0 cites
- 0353US2024063064A1Integrated dipole region for transistorAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0453US2025126867A1Interfacial layer scaling processes for semiconductor devicesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0551US2023377879A1Barrier layer for preventing aluminum diffusionAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0650US2024266414A1Multi-vt integration scheme for semiconductor devicesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0750US2024204061A1Method of reducing metal gate resistance for next generation nmos device applicationAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0849US2024222195A1Dipole formation processesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0948US2025285867A1Work function layer for pmos stackAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1048US2024363723A1Multi-threshold voltage integration scheme for semiconductor devicesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →