Inventor · disambiguated record
Terrence B. Mcdaniel
Also filed as: MCDANIEL TERRENCE · MCDANIEL TERRENCE B
31 granted patents·16 pending applications·535 citations·filing 1999–2025
96Inventor score
Top patents by PatentIndex Score
47 records- 0198US6350679B1Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitryMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 26, 2002·336 cites·27 claims
- 0296US11488981B2Array of vertical transistors and method used in forming an array of vertical transistorsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 1, 2022·4 cites·22 claims
- 0396US7517754B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 14, 2009·44 cites·19 claims
- 0495US7341909B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 11, 2008·37 cites·22 claims
- 0593US11785764B2Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 10, 2023·2 cites·16 claims
- 0693US11282548B1Integrated assemblies and methods forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 22, 2022·6 cites·34 claims
- 0791US7491641B2Method of forming a conductive line and a method of forming a conductive contact adjacent to and insulated from a conductive lineMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 17, 2009·20 cites·27 claims
- 0890US11393908B1Methods of forming a microelectronic device, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 19, 2022·7 cites·23 claims
- 0986US7445996B2Low resistance peripheral contacts while maintaining DRAM array integrityMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 4, 2008·13 cites·17 claims
- 1085US11915777B2Integrated assemblies and methods forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 27, 2024·1 cites·21 claims
- 1184US11309315B2Digit line formation for horizontally oriented access devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·2 cites·29 claims
- 1281US2025275249A1Array Of Vertical Transistors And Method Used In Forming An Array Of Vertical TransistorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1378US8580666B2Methods of forming conductive contactsMCDANIEL TERRENCE·Filed 2011·Granted Nov 12, 2013·4 cites·16 claims
- 1478US6258709B1Formation of electrical interconnect lines by selective metal etchMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 10, 2001·22 cites·23 claims
- 1576US7902057B2Methods of fabricating dual fin structuresMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 8, 2011·5 cites·24 claims
- 1674US12336288B2Array of vertical transistors and method used in forming an array of vertical transistorsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 1772US2024153541A1Integrated Assemblies and Methods Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1871US7501672B2Method and structure for a self-aligned silicided word line and polysilicon plug during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 10, 2009·4 cites·20 claims
- 1971US7364966B2Method for forming a buried digit line with self aligning spacing layer and contact plugs during the formation of a semiconductor device, semiconductor devices, and systems including sameMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 29, 2008·3 cites·16 claims
- 2065US8026542B2Low resistance peripheral local interconnect contacts with selective wet strip of titaniumMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 27, 2011·1 cites·29 claims
- 2164US12069848B2Sense line and cell contact for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 20, 2024·0 cites·19 claims
- 2262US2024379596A1Conductive pad on a through-silicon viaMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2361US2025391711A1Heterogenous integration of semiconductor structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2460US7119024B2Method and structure for a self-aligned silicided word line and polysilicon plug during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 10, 2006·8 cites·35 claims
- 2559US7935997B2Low resistance peripheral contacts while maintaining DRAM array integrityMICRON TECHNOLOGY INC·Filed 2006·Granted May 3, 2011·1 cites·24 claims
- 2659US6844255B2Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitryMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 18, 2005·7 cites·32 claims
- 2758US7605033B2Low resistance peripheral local interconnect contacts with selective wet strip of titaniumMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 20, 2009·4 cites·25 claims
- 2858US2024071823A1Semiconductor device circuitry formed through volumetric expansionMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2958US2024292603A1Damascene digit linesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3056US2014027913A1Semiconductor structures comprising conductive material lining openings in an insulative materialMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 3155US7800137B2Semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2009·Granted Sep 21, 2010·0 cites·8 claims
- 3255US2024063094A1Semiconductor device assemblies with a cavity exposing through-silicon vias for controller attachmentMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3355US2024064972A1Memory device including structures in memory array region and periperal circuitry regionMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3455US2025336772A1Semiconductor devices with nano-vias, such as nano-through-silicon vias landing on middle-of-line or back-end-of-line layersMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3555US2025323125A1Semiconductor device with backside interface mechanism and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3655US2025336854A1Protruded bond pads for hybrid bonding of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3754US7821052B2Method for forming a buried digit line with self aligning spacing layer and contact plugs during the formation of a semiconductor device, semiconductor devices, and systems including sameMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·0 cites·7 claims
- 3852US11257766B1Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 22, 2022·0 cites·28 claims
- 3952US7118966B2Methods of forming conductive linesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 10, 2006·4 cites·44 claims
- 4051US2024063068A1Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposersMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4151US2024038588A1Methods of forming the microelectronic devices, and related microelectonic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4251US2024079369A1Connecting semiconductor dies through tracesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4349US7883959B2Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 2010·Granted Feb 8, 2011·0 cites·5 claims
- 4448US7557001B2Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·0 cites·18 claims
- 4544US2011101429A1Semiconductor device structures with dual fin structures and electronic deviceMICRON TECHNOLOGY INC·Filed 2011·Application pending·0 cites
- 4641US7329618B2Ion implanting methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 12, 2008·0 cites·67 claims
- 4728US8772163B2Semiconductor processing method and semiconductor structurePRETTI DENNIS J·Filed 2012·Granted Jul 8, 2014·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →