Inventor · disambiguated record
Tengfei Miao
Also filed as: Miao tengfei
3 granted patents·2 pending applications·0 citations·filing 2020–2025
44Inventor score
Files withLAM RES CORP5
Top patents by PatentIndex Score
5 records- 0173US2025046613A1Method for providing doped silicon using a diffusion barrier layerLAM RES CORP·Filed 2024·Application pending·0 cites
- 0268US2025266274A1Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2025·Application pending·0 cites
- 0362US12125705B2Method for providing doped silicon using a diffusion barrier layerLAM RES CORP·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 0461US12322619B2Dynamic process control in semiconductor manufacturingLAM RES CORP·Filed 2020·Granted Jun 3, 2025·0 cites·21 claims
- 0552US12157945B2Thermal atomic layer deposition of silicon-containing filmsLAM RES CORP·Filed 2020·Granted Dec 3, 2024·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →