Inventor · disambiguated record
Tetsuro Nishimura
Also filed as: NISHIMURA TETSURO
30 granted patents·7 pending applications·291 citations·filing 1985–2021
96Inventor score
Files withNIHON SUPERIOR CO LTD13NISHIMURA TETSURO9TERUMO CORP5NIHON SUPERIOR SHA CO LTD4APPLIED NANOPARTICLE LABORATORY CORP1
Top patents by PatentIndex Score
37 records- 0189US5417771ASoldering fluxTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1994·Granted May 23, 1995·67 cites·19 claims
- 0284US11839937B2Lead-free solder alloy and solder joint partNIHON SUPERIOR CO LTD·Filed 2020·Granted Dec 12, 2023·1 cites·12 claims
- 0375US8557021B2Method of regulating nickel concentration in lead-free solder containing nickelNISHIMURA TETSURO·Filed 2008·Granted Oct 15, 2013·2 cites·5 claims
- 0474US6044769AIn-pipe work apparatusTOSHIBA KK·Filed 1997·Granted Apr 4, 2000·48 cites·5 claims
- 0572US6296722B1Lead-free solder alloyNIHON SUPERIOR SHA CO LTD·Filed 1999·Granted Oct 2, 2001·30 cites·3 claims
- 0669US12172242B2Lead-free solder alloyNIHON SUPERIOR CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·12 claims
- 0768US12377501B2Solder preform containing Cu—Co particlesNIHON SUPERIOR CO LTD·Filed 2020·Granted Aug 5, 2025·0 cites·3 claims
- 0868US8999519B2Solder jointNISHIMURA TETSURO·Filed 2008·Granted Apr 7, 2015·3 cites·19 claims
- 0966US9999945B2Solder alloyNISHIMURA TETSURO·Filed 2012·Granted Jun 19, 2018·1 cites·7 claims
- 1066US9339893B2Lead-free solder alloyNISHIMURA TETSURO·Filed 2012·Granted May 17, 2016·1 cites·3 claims
- 1166US4911696ABranch tubeTERUMO CORP·Filed 1988·Granted Mar 27, 1990·26 cites·8 claims
- 1262US2024238915A1Lead-free solder pasteNIHON SUPERIOR CO LTD·Filed 2021·Application pending·0 cites
- 1360US2014224861A1Wire solder, method of feeding the same, and apparatus and system thereforNIHON SUPERIOR CO LTD·Filed 2014·Application pending·0 cites
- 1459US7861909B2Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bathNIHON SUPERIOR SHA CO LTD·Filed 2006·Granted Jan 4, 2011·1 cites·6 claims
- 1558US5772101AWave soldering machineNS TEKUNO CO LTD·Filed 1996·Granted Jun 30, 1998·26 cites·6 claims
- 1657US10286497B2Lead-free solder alloyNIHON SUPERIOR CO LTD·Filed 2015·Granted May 14, 2019·0 cites·6 claims
- 1757US8163061B2Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tinNISHIMURA TETSURO·Filed 2009·Granted Apr 24, 2012·0 cites·6 claims
- 1856US6699306B2Control method for copper density in a solder dipping bathNIHON SUPERIOR SHA CO LTD·Filed 2001·Granted Mar 2, 2004·7 cites·21 claims
- 1955US2012286026A1Wire solder, method of feeding the same and apparatus thereforNISHIMURA TETSURO·Filed 2012·Application pending·0 cites
- 2055US2012280020A1Wire solder, method of feeding the same and apparatus thereforNISHIMURA TETSURO·Filed 2012·Application pending·0 cites
- 2153US11980974B2Solder joint part and method for manufacturing the sameNIHON SUPERIOR CO LTD·Filed 2019·Granted May 14, 2024·0 cites·8 claims
- 2252US9999936B2Solder wire bobbinless coilNIHON SUPERIOR CO LTD·Filed 2016·Granted Jun 19, 2018·0 cites·6 claims
- 2351US7591873B2Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tinNIHON SUPERIOR SHA CO LTD·Filed 2006·Granted Sep 22, 2009·0 cites·6 claims
- 2450US8652269B2Flux composition and soldering paste compositionNISHIMURA TETSURO·Filed 2009·Granted Feb 18, 2014·0 cites·33 claims
- 2550US5487868ATin based solder alloy containing lead, antimony, and telluriumNIHON SUPERIOR CO LTD·Filed 1994·Granted Jan 30, 1996·9 cites·2 claims
- 2647US8147746B2Apparatus for precipitation/separation of excess copper in lead-free solderNISHIMURA TETSURO·Filed 2006·Granted Apr 3, 2012·0 cites·5 claims
- 2747US2011272454A1Wire solder, method of feeding the same and apparatus thereforNIHON SUPERIOR CO LTD·Filed 2010·Application pending·0 cites
- 2846US10329642B2Solder alloy and joint thereofNIHON SUPERIOR CO LTD·Filed 2014·Granted Jun 25, 2019·0 cites·3 claims
- 2944US10427220B2Nanoparticle production method, production device and automatic production deviceAPPLIED NANOPARTICLE LABORATORY CORP·Filed 2013·Granted Oct 1, 2019·0 cites·7 claims
- 3041US4816219ALow-temperature solder compositionNIHON SPERIASHA CO LTD·Filed 1987·Granted Mar 28, 1989·8 cites·8 claims
- 3140US4899903ATube assembly provided with a breakaway plugTERUMO CORP·Filed 1988·Granted Feb 13, 1990·32 cites·3 claims
- 3240USD297367SManifold for connecting tubes in blood administration equipmentTERUMO CORP·Filed 1985·Granted Aug 23, 1988·4 cites·1 claims
- 3340US2022281035A1Solder-metal mesh composite material and method for producing sameNIHON SUPERIOR CO LTD·Filed 2020·Application pending·0 cites
- 3438US10966618B2Lifesaving assisting apparatusNIHON KOHDEN CORP·Filed 2016·Granted Apr 6, 2021·0 cites·10 claims
- 3538US2020140975A1Soldered JointNIHON SUPERIOR CO LTD·Filed 2018·Application pending·0 cites
- 3629US4915704ATube assembly with a breakaway plugTERUMO CORP·Filed 1988·Granted Apr 10, 1990·13 cites·6 claims
- 3727US4657535AMedical needle device and medical equipment having the sameTERUMO CORP·Filed 1985·Granted Apr 14, 1987·12 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →