Wire solder, method of feeding the same and apparatus therefor

Abstract

Provided is an apparatus for feeding wire solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.

1 . A solder supplying device, comprising:
 a solder storage that stores wire solder including a core wire or a wire solder bundle; and   a core wire storage that stores the core wire while collecting the core wire from a front end side of the wire solder, wherein   while the core wire storage is rotated to collect the core wire, the wire solder or the wire solder bundle is partially heated upstream of the collecting to melt solder for soldering.   
     
     
         2 . The solder supplying device according to  claim 1 , wherein the core wire storage has a reel structure, and is rotated by motor driving to collect the core wire. 
     
     
         3 . The solder supplying device according to  claim 1 , wherein the core wire comprises a thermosetting resin that does not change in quality at a joint temperature of the solder wire. 
     
     
         4 . The solder supplying device according to  claim 3 , wherein the core wire comprises at least one resin selected from the group consisting of phenol resin, epoxy resin, melamine resin, aromatic polyamide-based resin, carbon fiber and polyimide-based resin. 
     
     
         5 . The solder supplying device according to  claim 1 , wherein the core wire comprises a material that generates Joule heat. 
     
     
         6 . The solder supplying device according to  claim 5 , wherein the core wire comprises at least one metal wire selected from the group consisting of a tungsten wire, a stainless steel wire, a piano wire, an iron wire, an aluminum wire and a copper wire. 
     
     
         7 . The solder supplying device according to  claim 1 , wherein the wire solder comprises a bundle of a plurality of solder wires. 
     
     
         8 . The solder supplying device according to  claim 1 , wherein the solder wire comprises a flux cored solder wire including flux along a center axis. 
     
     
         9 . The solder supplying device according to  claim 1 , wherein the core wire has a higher melting temperature than that of the solder wire so that the core wire tolerates heating.