Inventor · disambiguated record
Teikou Odashima
Also filed as: ODASHIMA TEIKOU
2 granted patents·150 citations·filing 1998–2000
67Inventor score
Top patents by PatentIndex Score
2 records- 0189US5998243AMethod for manufacturing semiconductor device and apparatus for resin-encapsulatingTOSHIBA KK·Filed 1998·Granted Dec 7, 1999·137 cites·2 claims
- 0274US6436331B1Method of resin sealing a gap between a semiconductor chip and a substrateTOWA CORP·Filed 2000·Granted Aug 20, 2002·13 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →