Inventor · disambiguated record
Tetsuya Ohishi
Also filed as: OHISHI TETSUYA
8 granted patents·2 pending applications·47 citations·filing 1995–2025
83Inventor score
Top patents by PatentIndex Score
10 records- 0176US10403814B2Method of cleaning and method of plasma processingTOKYO ELECTRON LTD·Filed 2016·Granted Sep 3, 2019·2 cites·8 claims
- 0274US10944051B2Method of cleaning a substrate processing apparatus and the substrate processing apparatus performing the methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 9, 2021·1 cites·16 claims
- 0371US11251052B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Feb 15, 2022·2 cites·11 claims
- 0471US5945167AMethod of manufacturing composite materialHONDA MOTOR CO LTD·Filed 1997·Granted Aug 31, 1999·25 cites·8 claims
- 0563US9139901B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2014·Granted Sep 22, 2015·1 cites·13 claims
- 0655US2025357088A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0746US6071464AProcess for modifying surfaces of hard materials and cutting toolsHONDA MOTOR CO LTD·Filed 1998·Granted Jun 6, 2000·13 cites·1 claims
- 0844US2025149300A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0936US8652309B2Sputtering apparatus and electronic device manufacturing methodOHISHI TETSUYA·Filed 2010·Granted Feb 18, 2014·0 cites·4 claims
- 1030US5704994AMethod of case-hardening shaped objectHONDA MOTOR CO LTD·Filed 1995·Granted Jan 6, 1998·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →