Inventor · disambiguated record
Teruo Okina
Also filed as: OKINA TERUO
14 granted patents·5 pending applications·109 citations·filing 2019–2024
91Inventor score
Top patents by PatentIndex Score
19 records- 0198US11201107B2Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layerSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Dec 14, 2021·34 cites·20 claims
- 0298US11195781B2Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layerSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Dec 7, 2021·22 cites·20 claims
- 0397US11631690B2Three-dimensional memory device including trench-isolated memory planes and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Apr 18, 2023·10 cites·20 claims
- 0497US11508711B2Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layerSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Nov 22, 2022·7 cites·20 claims
- 0597US11393836B2Three-dimensional memory device with separated source-side lines and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jul 19, 2022·7 cites·20 claims
- 0697US11322466B2Semiconductor die containing dummy metallic pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 3, 2022·12 cites·20 claims
- 0791US11889684B2Three-dimensional memory device with separated source-side lines and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jan 30, 2024·2 cites·18 claims
- 0889US11094704B2Method of forming a three-dimensional memory device and a driver circuit on opposite sides of a substrateSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 17, 2021·6 cites·3 claims
- 0988US11450624B2Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Sep 20, 2022·2 cites·13 claims
- 1087US11444039B2Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Sep 13, 2022·2 cites·7 claims
- 1187US11088076B2Bonding pads embedded in a dielectric diffusion barrier and having recessed metallic linersSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 10, 2021·5 cites·14 claims
- 1261US2024215244A1Memory device containing constricted channel ends and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1361US2024040786A1Three-dimensional memory device containing etch stop metal plates for backside via structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1460US2024332180A1Three-dimensional memory device including schottky barrier source contacts and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1557US12457735B2Three-dimensional memory device containing etch stop metal plates for backside via structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 28, 2025·0 cites·4 claims
- 1657US2024334697A1Three-dimensional memory device including a source structure surrounded by inner sidewalls of vertical semiconductor channels and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1756US2024407164A1Three-dimensional memory devices including self-aligned channel cap structures and methods for forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1852US12108597B2Three-dimensional memory device containing a pillar contact between channel and source and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 1950US12256542B2Three-dimensional memory device containing a pillar contact between channel and source and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →