Inventor · disambiguated record
Tetsuya Oyamada
Also filed as: OYAMADA TETSUYA
21 granted patents·7 pending applications·12 citations·filing 2014–2023
89Inventor score
Technology areasH10W
Files withNIPPON MICROMETAL CORP16NIPPON STEEL CHEMICAL & MAT CO LTD11NIPPON STEEL & SUMIKIN MAT CO1
Top patents by PatentIndex Score
28 records- 0187US11612966B2Ag alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Mar 28, 2023·2 cites·8 claims
- 0286US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 0386US10381320B2Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmiumNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Aug 13, 2019·6 cites·18 claims
- 0469US12412864B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·7 claims
- 0564US10840208B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Nov 17, 2020·1 cites·12 claims
- 0662US9812421B2Bonding wire for semiconductor devicesNIPPON STEEL & SUMIKIN MAT CO·Filed 2014·Granted Nov 7, 2017·1 cites·9 claims
- 0758US12166006B2Bonding wire for semiconductor devicesNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·9 claims
- 0857US12334467B2Copper bonding wireNIPPON MICROMETAL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·7 claims
- 0955US12388044B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·4 claims
- 1055US12132025B2Bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·4 claims
- 1155US10985130B2Cu alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·8 claims
- 1254US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
- 1354US12325901B2AI wiring materialNIPPON MICROMETAL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
- 1453US2025379177A1Al ALLOY BONDING WIRENIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2023·Application pending·0 cites
- 1551US11342299B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2016·Granted May 24, 2022·0 cites·8 claims
- 1651US10991672B2Cu alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Apr 27, 2021·0 cites·6 claims
- 1751US10790259B2Cu alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·8 claims
- 1850US10950571B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·4 claims
- 1949US12463171B2Copper bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2020·Granted Nov 4, 2025·0 cites·5 claims
- 2048US2024105668A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2147US10529683B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2016·Granted Jan 7, 2020·0 cites·5 claims
- 2245US10032741B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Jul 24, 2018·0 cites·8 claims
- 2345US2024071978A1Al BONDING WIRE FOR SEMICONDUCTOR DEVICESNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2445US2024110262A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2545US2023402422A1Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICENIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
- 2645US2024312946A1Ai bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2743US10950570B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Mar 16, 2021·0 cites·8 claims
- 2843US2023302584A1Al WIRING MATERIALNIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →