Inventor · disambiguated record
Terence M. Thomas
Also filed as: THOMAS TERENCE M
24 granted patents·14 pending applications·450 citations·filing 1984–2013
96Inventor score
Files withRODEL INC10ROHM & HAAS ELECT MAT9THOMAS TERENCE M4GHOSH TIRTHANKAR1ROHN AND HAAS ELECTRONIC MATER1
Top patents by PatentIndex Score
38 records- 0191US4547432AMethod of bonding silver to glass and mirrors produced according to this methodUS ENERGY·Filed 1984·Granted Oct 15, 1985·82 cites·17 claims
- 0288US6607424B1Compositions for insulator and metal CMP and methods relating theretoRODEL INC·Filed 2000·Granted Aug 19, 2003·47 cites·16 claims
- 0386US6971945B2Multi-step polishing solution for chemical mechanical planarizationROHM & HAAS ELECT MAT·Filed 2004·Granted Dec 6, 2005·21 cites·10 claims
- 0485US6699299B2Composition and method for polishing in metal CMPRODEL INC·Filed 2003·Granted Mar 2, 2004·34 cites·21 claims
- 0585US6605537B2Polishing of metal substratesRODEL INC·Filed 2001·Granted Aug 12, 2003·35 cites·1 claims
- 0685US6379406B1Polishing compositions for semiconductor substratesRODEL INC·Filed 2000·Granted Apr 30, 2002·34 cites·14 claims
- 0782US7387964B2Copper polishing cleaning solutionROHM & HAAS ELECT MAT·Filed 2003·Granted Jun 17, 2008·24 cites·10 claims
- 0882US6616717B2Composition and method for polishing in metal CMPRODEL INC·Filed 2001·Granted Sep 9, 2003·28 cites·22 claims
- 0979US6602112B2Dissolution of metal particles produced by polishingRODEL INC·Filed 2001·Granted Aug 5, 2003·22 cites·15 claims
- 1079US6475069B1Control of removal rates in CMPRODEL INC·Filed 2000·Granted Nov 5, 2002·21 cites·9 claims
- 1176US6447373B1Chemical mechanical polishing slurries for metalRODEL INC·Filed 2000·Granted Sep 10, 2002·21 cites·31 claims
- 1272US6641631B2Polishing of semiconductor substratesRODEL INC·Filed 2002·Granted Nov 4, 2003·14 cites·5 claims
- 1369US7785487B2Polymeric barrier removal polishing slurryROHM & HAAS ELECT MAT·Filed 2006·Granted Aug 31, 2010·3 cites·10 claims
- 1469US6530824B2Method and composition for polishing by CMPRODEL INC·Filed 2001·Granted Mar 11, 2003·15 cites·22 claims
- 1566US7132058B2Tungsten polishing solutionROHM & HAAS ELECT MAT·Filed 2003·Granted Nov 7, 2006·15 cites·13 claims
- 1666US6936541B2Method for planarizing metal interconnectsROHN AND HAAS ELECTRONIC MATER·Filed 2003·Granted Aug 30, 2005·13 cites·10 claims
- 1763US7253111B2Barrier polishing solutionROHM & HAAS ELECT MAT·Filed 2004·Granted Aug 7, 2007·9 cites·10 claims
- 1858US7084059B2CMP system for metal depositionROHM & HAAS ELECT MAT·Filed 2003·Granted Aug 1, 2006·6 cites·10 claims
- 1954US8563436B2Chemical mechanical polishing composition and methods relating theretoROHM & HAAS ELECT MAT·Filed 2013·Granted Oct 22, 2013·0 cites·7 claims
- 2051US6664188B2Semiconductor wafer with a resistant filmFiled 2001·Granted Dec 16, 2003·3 cites·10 claims
- 2150US8540893B2Chemical mechanical polishing composition and methods relating theretoGHOSH TIRTHANKAR·Filed 2008·Granted Sep 24, 2013·0 cites·9 claims
- 2249US7270762B2Polishing compositions for noble metalsROHM & HAAS ELECT MAT·Filed 2003·Granted Sep 18, 2007·2 cites·10 claims
- 2346US7070485B2Polishing compositionROHM & HAAS ELECT MAT·Filed 2001·Granted Jul 4, 2006·1 cites·23 claims
- 2445US2005104048A1Compositions and methods for polishing copperFiled 2003·Application pending·0 cites
- 2541US9633865B2Low-stain polishing compositionTHOMAS TERENCE M·Filed 2008·Granted Apr 25, 2017·0 cites·5 claims
- 2641US2002042199A1Polishing by CMP for optimized planarizationFiled 2001·Application pending·0 cites
- 2740US2003119692A1Copper polishing cleaning solutionFiled 2002·Application pending·0 cites
- 2840US2009215266A1Polishing Copper-Containing patterned wafersTHOMAS TERENCE M·Filed 2008·Application pending·0 cites
- 2939US2008029126A1Compositions and methods for improved planarization of copper utilizing inorganic oxide abrasiveTHOMAS TERENCE M·Filed 2006·Application pending·0 cites
- 3039US2002062600A1Polishing compositionFiled 2001·Application pending·0 cites
- 3138US2002039839A1Polishing compositions for noble metalsFiled 2001·Application pending·0 cites
- 3236US2005136671A1Compositions and methods for low downforce pressure polishing of copperFiled 2003·Application pending·0 cites
- 3336US2008276543A1Alkaline barrier polishing slurryTHOMAS TERENCE M·Filed 2007·Application pending·0 cites
- 3435US2003006396A1Polishing composition for CMP having abrasive particlesFiled 2002·Application pending·0 cites
- 3535US2002111027A1Polishing compositions for noble metalsFiled 2000·Application pending·0 cites
- 3635US2005136670A1Compositions and methods for controlled polishing of copperFiled 2003·Application pending·0 cites
- 3731US2003139047A1Metal polishing slurry having a static etch inhibitor and method of formulationFiled 2002·Application pending·0 cites
- 3831US2002019202A1Control of removal rates in CMPFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →