Inventor · disambiguated record
Tetsu Toda
Also filed as: TODA TETSU
14 granted patents·2 pending applications·99 citations·filing 2001–2020
89Inventor score
Top patents by PatentIndex Score
16 records- 0196US7710189B2Semiconductor device for RF switchingNEC ELECTRONICS CORP·Filed 2006·Granted May 4, 2010·51 cites·12 claims
- 0289US9621151B2Semiconductor device and electric power control apparatusRENESAS ELECTRONICS CORP·Filed 2016·Granted Apr 11, 2017·6 cites·17 claims
- 0384US9559687B2Semiconductor device, power control device and electronic systemRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 31, 2017·5 cites·16 claims
- 0479US9343453B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted May 17, 2016·3 cites·9 claims
- 0578US6507112B1Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding padsNEC COMPOUND SEMICONDUCTOR·Filed 2001·Granted Jan 14, 2003·29 cites·19 claims
- 0669US10224921B2Semiconductor device and electric power control apparatusRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·1 cites·4 claims
- 0769US9048213B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 2, 2015·2 cites·7 claims
- 0867US10008561B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 26, 2018·1 cites·30 claims
- 0966US10396547B2Semiconductor device and power control deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 27, 2019·1 cites·20 claims
- 1050US9866207B2Semiconductor device, power control device and electronic systemRENESAS ELECTRONICS CORP·Filed 2016·Granted Jan 9, 2018·0 cites·2 claims
- 1148US9287256B2Semiconductor device including a separation region formed around a first circuit regionRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 15, 2016·0 cites·15 claims
- 1247US10008919B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 26, 2018·0 cites·14 claims
- 1345US9324862B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 26, 2016·0 cites·9 claims
- 1441US2022140748A1Semiconductor device and inverter deviceRENESAS ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 1533US6784545B2Semiconductor device having pad electrode connected to wireNEC COMPOUND SEMICONDUCTOR·Filed 2003·Granted Aug 31, 2004·0 cites·8 claims
- 1632US2002027289A1Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding padsFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tetsu Toda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →