Inventor · disambiguated record
Thomas Behrens
Also filed as: BEHRENS THOMAS · BEHRENS THOMAS F
23 granted patents·8 pending applications·171 citations·filing 1984–2025
94Inventor score
Top patents by PatentIndex Score
31 records- 0193US11843917B2Hearing device comprising an input transducer in the earOTICON AS·Filed 2022·Granted Dec 12, 2023·2 cites·22 claims
- 0287US4552461AStirrer for stirring near a vessel wallHOECHST AG·Filed 1984·Granted Nov 12, 1985·54 cites·11 claims
- 0384US7082714B1Light vaseBEHRENS THOMAS F·Filed 2005·Granted Aug 1, 2006·27 cites·8 claims
- 0482USD513479SLight vaseBEHRENS THOMAS F·Filed 2005·Granted Jan 10, 2006·31 cites·1 claims
- 0577US8135139B2Frequency transposition applications for improving spatial hearing abilities of subjects with high-frequency hearing lossesNEHER TOBIAS·Filed 2008·Granted Mar 13, 2012·11 cites·15 claims
- 0677US7340231B2Method of programming a communication device and a programmable communication deviceOTICON AS·Filed 2002·Granted Mar 4, 2008·24 cites·8 claims
- 0776US12256197B2Hearing device comprising an input transducer in the earOTICON AS·Filed 2023·Granted Mar 18, 2025·0 cites·9 claims
- 0874US8330252B2Integrated circuit device and method for the production thereofMAHLER JOACHIM·Filed 2007·Granted Dec 11, 2012·7 cites·20 claims
- 0973US2025184672A1Hearing device comprising an input transducer in the earOTICON AS·Filed 2025·Application pending·0 cites
- 1065US11776927B2Semiconductor device including a solder compound containing a compound Sn/SbINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1163US8304884B2Semiconductor device including spacer elementNIKITIN IVAN·Filed 2009·Granted Nov 6, 2012·2 cites·23 claims
- 1262US7667337B2Semiconductor device with conductive die attach materialINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 23, 2010·2 cites·8 claims
- 1361US2021167034A1Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1458US8187964B2Integrated circuit device and methodMAHLER JOACHIM·Filed 2009·Granted May 29, 2012·1 cites·17 claims
- 1557US2025329546A1Lead frame and clip frame for molded semiconductor packages, and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1656US11069644B2Semiconductor device including a solder compound containing a compound Sn/SbINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·0 cites·16 claims
- 1754US2024030200A1Semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1853US11502042B2Processing of one or more carrier bodies and electronic components by multiple alignmentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 15, 2022·0 cites·16 claims
- 1953US10930614B2Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 23, 2021·0 cites·16 claims
- 2051US11264356B2Batch manufacture of packages by sheet separated into carriers after mounting of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 1, 2022·0 cites·21 claims
- 2149US9583413B2Semiconductor deviceNIKITIN IVAN·Filed 2009·Granted Feb 28, 2017·0 cites·11 claims
- 2248US9735126B2Solder alloys and arrangementsMENGEL MANFRED·Filed 2011·Granted Aug 15, 2017·0 cites·25 claims
- 2348US2023117806A1Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2448US2009115060A1Integrated circuit device and methodINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2546US7705441B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·0 cites·40 claims
- 2645USD726830SLawn board gameGoat Function LLC·Filed 2013·Granted Apr 14, 2015·8 cites·1 claims
- 2744US10700037B2Reinforcement for electrical connectorsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 30, 2020·0 cites·20 claims
- 2843US7885991B2Digital filter having a fir filter and a warped fir filter, and a listening device including such a digital filterOTICON AS·Filed 2004·Granted Feb 8, 2011·2 cites·6 claims
- 2943US2023178428A1Leaded semiconductor package formation using lead frame with structured central padINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3042US9123764B2Method of manufacturing a component comprising cutting a carrierBEHRENS THOMAS·Filed 2012·Granted Sep 1, 2015·0 cites·20 claims
- 3142US2008061449A1Semiconductor Component ArrangementINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →