Inventor · disambiguated record
Thomas Bemmerl
Also filed as: BEMMERL THOMAS
29 granted patents·9 pending applications·130 citations·filing 2002–2024
95Inventor score
Files withINFINEON TECHNOLOGIES AG31BEMMERL THOMAS2INFINEON TECHNOLOGIES AUSTRIA AG2MAHLER JOACHIM1OSRAM OPTO SEMICONDUCTORS GMBH1
Top patents by PatentIndex Score
38 records- 0189US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 0287US8916968B2Multichip power semiconductor deviceMAHLER JOACHIM·Filed 2012·Granted Dec 23, 2014·8 cites·21 claims
- 0382US7944061B2Semiconductor device having through contacts through a plastic housing composition and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 17, 2011·10 cites·10 claims
- 0480US12394697B2Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screwINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Aug 19, 2025·0 cites·13 claims
- 0579US7935622B2Support with solder ball elements and a method for populating substrates with solder ballsINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 3, 2011·6 cites·6 claims
- 0679US7064429B2Electronic package having integrated cooling element with clearance for engaging packageINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 20, 2006·28 cites·24 claims
- 0778US11088105B2Semiconductor device and method for fabricating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0878US7737537B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 15, 2010·9 cites·7 claims
- 0976US9681566B2Electronic arrangement and method for producing an electronic arrangementBEMMERL THOMAS·Filed 2011·Granted Jun 13, 2017·4 cites·28 claims
- 1070US10971457B2Semiconductor device comprising a composite material clipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·1 cites·20 claims
- 1169US12334405B2Electronic devices including vent openings and associated methodsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jun 17, 2025·0 cites·22 claims
- 1269US11955415B2Semiconductor device package comprising a pin in the form of a drilling screwINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 1369US10886186B2Semiconductor package systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·24 claims
- 1467US11069600B2Semiconductor package with space efficient lead and die pad designINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·1 cites·16 claims
- 1565US11869865B2Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 9, 2024·0 cites·7 claims
- 1664US8748201B2Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layerPREUSS STEPHAN·Filed 2011·Granted Jun 10, 2014·1 cites·11 claims
- 1763US10840172B2Leadframe, semiconductor package including a leadframe and method for forming a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
- 1863US8030741B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2010·Granted Oct 4, 2011·2 cites·20 claims
- 1963US2025022780A1Semiconductor Devices and Methods for Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2062US7800241B2Semiconductor device with semiconductor device components embedded in a plastics compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 21, 2010·2 cites·16 claims
- 2160US2020352034A1Methods for Manufacturing Electronic DevicesINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2259US2024347427A1Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2358US8848297B2Lens, optoelectronic component comprising a lens and method for producing a lensBEMMERL THOMAS·Filed 2010·Granted Sep 30, 2014·1 cites·13 claims
- 2457US7713791B2Panel and semiconductor device having a composite plate with semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 11, 2010·1 cites·17 claims
- 2556US11862582B2Package with elevated lead and structure extending vertically from encapsulant bottomINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 2655US9443760B2Multichip power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 13, 2016·0 cites·3 claims
- 2754US11869830B2Semiconductor package and clip with a die attachINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 9, 2024·0 cites·17 claims
- 2854US10950509B2Semiconductor device with integrated shunt resistorINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 16, 2021·0 cites·13 claims
- 2954US2020020649A1Cavity based feature on chip carrierINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3053US2023095545A1Semiconductor Packages and Methods for Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3152US10026710B2Electronic arrangementOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted Jul 17, 2018·0 cites·20 claims
- 3251US2018338379A1Joining Materials, Electronic Devices and Methods for Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3347US9484278B2Semiconductor package and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 1, 2016·0 cites·20 claims
- 3447US2017317036A1Cavity based feature on chip carrierINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 3543US2020051880A1Semiconductor device comprising a recess and method of fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3640US10978378B2Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrierINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 13, 2021·0 cites·13 claims
- 3738US7709379B2Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 4, 2010·0 cites·6 claims
- 3834US2020294896A1Lead Frame Stabilizer for Improved Lead PlanarityINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →