Inventor · disambiguated record
Thomas Buschhardt
Also filed as: BUSCHHARDT THOMAS
17 granted patents·5 pending applications·176 citations·filing 1997–2017
92Inventor score
Files withSILTRONIC AG11SCHWANDNER JUERGEN3WACKER SILTRONIC HALBLEITERMAT3SCHWAB GUENTER2SCHIENLE FRANK1
Top patents by PatentIndex Score
22 records- 0183US6530826B2Process for the surface polishing of silicon wafersWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Granted Mar 11, 2003·35 cites·11 claims
- 0280US7938911B2Process for cleaning a semiconductor wafer using a cleaning solutionSILTRONIC AG·Filed 2008·Granted May 10, 2011·8 cites·11 claims
- 0378US8070882B2Method for the wet-chemical treatment of a semiconductor waferSCHWAB GUENTER·Filed 2008·Granted Dec 6, 2011·8 cites·19 claims
- 0478US6095898AProcess and device for polishing semiconductor wafersWACKER SILTRONIC HALBLEITERMAT·Filed 1998·Granted Aug 1, 2000·51 cites·10 claims
- 0578US5980361AMethod and device for polishing semiconductor wafersWACKER SILTRONIC HALBLEITERMAT·Filed 1997·Granted Nov 9, 1999·54 cites·12 claims
- 0677US8647985B2Method for polishing a substrate composed of semiconductor materialSCHWANDNER JUERGEN·Filed 2008·Granted Feb 11, 2014·6 cites·13 claims
- 0775US8093143B2Method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front sideSTORCK PETER·Filed 2010·Granted Jan 10, 2012·4 cites·6 claims
- 0872US8721390B2Method for the double-side polishing of a semiconductor waferSCHWANDNER JUERGEN·Filed 2011·Granted May 13, 2014·3 cites·11 claims
- 0969US7541287B2Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the methodSILTRONIC AG·Filed 2006·Granted Jun 2, 2009·3 cites·6 claims
- 1065US7538008B2Method for producing a layer structureSILTRONIC AG·Filed 2007·Granted May 26, 2009·2 cites·11 claims
- 1162US11154908B2Separating apparatus for polysiliconSILTRONIC AG·Filed 2017·Granted Oct 26, 2021·1 cites·11 claims
- 1261US11059072B2Screen plate for screening plants for mechanical classification of polysiliconSILTRONIC AG·Filed 2016·Granted Jul 13, 2021·1 cites·16 claims
- 1354US8372213B2Method for the treatment of a semiconductor waferSILTRONIC AG·Filed 2009·Granted Feb 12, 2013·0 cites·14 claims
- 1449US8647173B2Method for polishing a semiconductor waferSILTRONIC AG·Filed 2013·Granted Feb 11, 2014·0 cites·10 claims
- 1549US8580046B2Method for the treatment of a semiconductor waferSILTRONIC AG·Filed 2012·Granted Nov 12, 2013·0 cites·19 claims
- 1646US2008265375A1Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx LayerSILTRONIC AG·Filed 2008·Application pending·0 cites
- 1745US2009071507A1Process for cleaning a semiconductor waferSILTRONIC AG·Filed 2008·Application pending·0 cites
- 1845US2011097974A1Method for polishing a semiconductor waferSILTRONIC AG·Filed 2010·Application pending·0 cites
- 1942US9230794B2Process for cleaning, drying and hydrophilizing a semiconductor waferSCHWAB GUENTER·Filed 2008·Granted Jan 5, 2016·0 cites·10 claims
- 2036US8685270B2Method for producing a semiconductor waferSCHWANDNER JUERGEN·Filed 2010·Granted Apr 1, 2014·0 cites·10 claims
- 2126US2012248068A1Process Module for the Inline-Treatment of SubstratesSCHIENLE FRANK·Filed 2010·Application pending·0 cites
- 2224US2002187639A1Process for treating a polished semiconductor water immediately after the semiconductor wafer has been polishedFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →