Inventor · disambiguated record
Thomas H. Distefano
Also filed as: DI STEFANO THOMAS H · DISTEFANO THOMAS · DISTEFANO THOMAS H · DISTEFANO THOMAS HERMAN
192 granted patents·13 pending applications·20,408 citations·filing 1973–2010
99Inventor score
Top patents by PatentIndex Score
205 records- 0199US5802699AMethods of assembling microelectronic assembly with socket for engaging bump leadsTESSERA INC·Filed 1994·Granted Sep 8, 1998·434 cites·30 claims
- 0299US5679977ASemiconductor chip assemblies, methods of making same and components for sameTESSERA INC·Filed 1993·Granted Oct 21, 1997·575 cites·27 claims
- 0399US5659952AMethod of fabricating compliant interface for semiconductor chipTESSERA INC·Filed 1994·Granted Aug 26, 1997·491 cites·48 claims
- 0499US5590460AMethod of making multilayer circuitTESSERA INC·Filed 1994·Granted Jan 7, 1997·172 cites·34 claims
- 0599US5518964AMicroelectronic mounting with multiple lead deformation and bondingTESSERA INC·Filed 1994·Granted May 21, 1996·659 cites·49 claims
- 0699US5455390AMicroelectronics unit mounting with multiple lead bondingTESSERA INC·Filed 1994·Granted Oct 3, 1995·407 cites·23 claims
- 0799US5347159ASemiconductor chip assemblies with face-up mounting and rear-surface connection to substrateTESSERA INC·Filed 1991·Granted Sep 13, 1994·351 cites·27 claims
- 0899US5258330ASemiconductor chip assemblies with fan-in leadsTESSERA INC·Filed 1993·Granted Nov 2, 1993·222 cites·16 claims
- 0998US7393214B2High performance electrical connectorCENTIPEDE SYSTEMS INC·Filed 2007·Granted Jul 1, 2008·77 cites·14 claims
- 1098US6465893B1Stacked chip assemblyTESSERA INC·Filed 2000·Granted Oct 15, 2002·152 cites·66 claims
- 1198US6202297B1Socket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1998·Granted Mar 20, 2001·208 cites·8 claims
- 1298US6194291B1Microelectronic assemblies with multiple leadsTESSERA INC·Filed 1999·Granted Feb 27, 2001·182 cites·14 claims
- 1398US5810609ASocket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1995·Granted Sep 22, 1998·167 cites·26 claims
- 1498US5801441AMicroelectronic mounting with multiple lead deformation and bondingTESSERA INC·Filed 1995·Granted Sep 1, 1998·245 cites·16 claims
- 1598US5632631AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1994·Granted May 27, 1997·280 cites·13 claims
- 1698US5536909ASemiconductor connection components and methods with releasable lead supportTESSERA INC·Filed 1994·Granted Jul 16, 1996·254 cites·27 claims
- 1798US5282312AMulti-layer circuit construction methods with customization featuresTESSERA INC·Filed 1991·Granted Feb 1, 1994·248 cites·20 claims
- 1898US5148265ASemiconductor chip assemblies with fan-in leadsIST ASSOCIATES INC·Filed 1991·Granted Sep 15, 1992·957 cites·50 claims
- 1998US5148266ASemiconductor chip assemblies having interposer and flexible leadIST ASSOCIATES INC·Filed 1990·Granted Sep 15, 1992·927 cites·25 claims
- 2097US7272888B2Method of fabricating semiconductor chip assembliesTESSERA INC·Filed 2002·Granted Sep 25, 2007·87 cites·9 claims
- 2197US6362520B2Microelectronic mounting with multiple lead deformation using restraining strapsTESSERA INC·Filed 2001·Granted Mar 26, 2002·117 cites·44 claims
- 2297US6044548AMethods of making connections to a microelectronic unitTESSERA INC·Filed 1998·Granted Apr 4, 2000·119 cites·6 claims
- 2397US6046076AVacuum dispense method for dispensing an encapsulant and machine thereforTESSERA INC·Filed 1997·Granted Apr 4, 2000·143 cites·25 claims
- 2497US5980270ASoldering with resilient contactsTESSERA INC·Filed 1996·Granted Nov 9, 1999·249 cites·34 claims
- 2597US5688716AFan-out semiconductor chip assemblyTESSERA INC·Filed 1996·Granted Nov 18, 1997·225 cites·17 claims
- 2697US5682061AComponent for connecting a semiconductor chip to a substrateTESSERA INC·Filed 1995·Granted Oct 28, 1997·202 cites·5 claims
- 2797US5615824ASoldering with resilient contactsTESSERA INC·Filed 1995·Granted Apr 1, 1997·217 cites·15 claims
- 2897US5489749ASemiconductor connection components and method with releasable lead supportTESSERA INC·Filed 1994·Granted Feb 6, 1996·208 cites·12 claims
- 2997US5346861ASemiconductor chip assemblies and methods of making sameTESSERA INC·Filed 1992·Granted Sep 13, 1994·243 cites·21 claims
- 3097US4587579ASystem for position detection on a rotating diskIBM·Filed 1982·Granted May 6, 1986·62 cites·4 claims
- 3196US6365975B1Chip with internal signal routing in external elementTESSERA INC·Filed 1998·Granted Apr 2, 2002·240 cites·27 claims
- 3296US6359335B1Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structuresTESSERA INC·Filed 2000·Granted Mar 19, 2002·113 cites·10 claims
- 3396US6205660B1Method of making an electronic contactTESSERA INC·Filed 1997·Granted Mar 27, 2001·152 cites·15 claims
- 3496US6086386AFlexible connectors for microelectronic elementsTESSERA INC·Filed 1997·Granted Jul 11, 2000·248 cites·46 claims
- 3596US6075289AThermally enhanced packaged semiconductor assembliesTESSERA INC·Filed 1996·Granted Jun 13, 2000·212 cites·23 claims
- 3696US6054756AConnection components with frangible leads and busTESSERA INC·Filed 1999·Granted Apr 25, 2000·229 cites·9 claims
- 3796US6007349AFlexible contact post and post socket and associated methods thereforTESSERA INC·Filed 1997·Granted Dec 28, 1999·125 cites·53 claims
- 3896US5929517ACompliant integrated circuit package and method of fabricating the sameTESSERA INC·Filed 1994·Granted Jul 27, 1999·185 cites·16 claims
- 3996US5834339AMethods for providing void-free layers for semiconductor assembliesTESSERA INC·Filed 1996·Granted Nov 10, 1998·143 cites·93 claims
- 4096US5812378AMicroelectronic connector for engaging bump leadsTESSERA INC·Filed 1995·Granted Sep 22, 1998·239 cites·60 claims
- 4196US5787581AMethods of making semiconductor connection components with releasable load supportTESSERA INC·Filed 1995·Granted Aug 4, 1998·162 cites·11 claims
- 4296US5685885AWafer-scale techniques for fabrication of semiconductor chip assembliesTESSERA INC·Filed 1994·Granted Nov 11, 1997·157 cites·23 claims
- 4396US3972059ADielectric diode, fabrication thereof, and charge store memory therewithIBM·Filed 1973·Granted Jul 27, 1976·74 cites·6 claims
- 4495US7454834B2Method of fabricating semiconductor chip assembliesTESSERA INC·Filed 2006·Granted Nov 25, 2008·32 cites·7 claims
- 4595US7166914B2Semiconductor package with heat sinkTESSERA INC·Filed 2004·Granted Jan 23, 2007·81 cites·7 claims
- 4695US6525429B1Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2000·Granted Feb 25, 2003·69 cites·20 claims
- 4795US6433419B2Face-up semiconductor chip assembliesTESSERA INC·Filed 2000·Granted Aug 13, 2002·71 cites·29 claims
- 4895US6324754B1Method for fabricating microelectronic assembliesTESSERA INC·Filed 1998·Granted Dec 4, 2001·164 cites·26 claims
- 4995US6126428AVacuum dispense apparatus for dispensing an encapsulantTESSERA INC·Filed 1999·Granted Oct 3, 2000·99 cites·9 claims
- 5095US6012224AMethod of forming compliant microelectronic mounting deviceTESSERA INC·Filed 1997·Granted Jan 11, 2000·157 cites·19 claims
Showing the top 50 of 205 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →