Inventor · disambiguated record
Thai Kee Gan
Also filed as: GAN THAI KEE
10 granted patents·8 pending applications·4 citations·filing 2019–2024
78Inventor score
Top patents by PatentIndex Score
18 records- 0190US11652078B2High voltage semiconductor package with pin fit leadsINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 16, 2023·3 cites·17 claims
- 0270US12205874B2Semiconductor package with wire bond jointsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0367US11069600B2Semiconductor package with space efficient lead and die pad designINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·1 cites·16 claims
- 0460US11842953B2Semiconductor package with wire bond joints and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 0560US2025285947A1Semiconductor package with combined lead frame and clip frameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0660US2025286011A1Semiconductor package with hybrid interconnect clipINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0759US2024347427A1Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0856US12068213B2Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 20, 2024·0 cites·18 claims
- 0956US2025201754A1Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between themINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1054US11984392B2Semiconductor package having a chip carrier with a pad offset featureINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1153US2024087995A1Power semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1252US11348866B2Package and lead frame design for enhanced creepage and clearanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 1351US2024243092A1Semiconductor package in a source-down configuration by use of vertical connectorsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1450US11417538B2Semiconductor package including leads of different lengthsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 16, 2022·0 cites·10 claims
- 1550US11011456B2Lead frames including lead posts in different planesINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1650US2024170374A1Semiconductor Package with Current SensingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 1748US12057376B2Three level interconnect clipINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 6, 2024·0 cites·17 claims
- 1846US2022108949A1Semiconductor packages including a u-shaped railINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →