Inventor · disambiguated record
Thomas H. Koschmieder
Also filed as: KOSCHMIEDER THOMAS · KOSCHMIEDER THOMAS H · KOSCHMIEDER THOMAS HANS
8 granted patents·6 pending applications·101 citations·filing 2000–2024
82Inventor score
Files withFREESCALE SEMICONDUCTOR INC5KOSCHMIEDER THOMAS H2CARPENTER BURTON J1CHOPIN SHEILA F1KOSCHMIEDER THOMAS1
Top patents by PatentIndex Score
14 records- 0191US6552436B2Semiconductor device having a ball grid array and method thereforMOTOROLA INC·Filed 2000·Granted Apr 22, 2003·83 cites·16 claims
- 0274US12505971B2Method for amplifying electromagnetic waves with wirebonded triodeKOSCHMIEDER THOMAS HANS·Filed 2024·Granted Dec 23, 2025·0 cites·23 claims
- 0366US11881373B2Triode with wirebonded structure and method of makingKOSCHMIEDER THOMAS·Filed 2022·Granted Jan 23, 2024·0 cites·14 claims
- 0462US7067907B2Semiconductor package having angulated interconnect surfacesFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jun 27, 2006·12 cites·17 claims
- 0560US7938016B2Multiple layer strain gaugeFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted May 10, 2011·2 cites·17 claims
- 0651US7074627B2Lead solder indicator and methodFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jul 11, 2006·4 cites·9 claims
- 0750US10217713B2Semiconductor device attached to an exposed padNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·16 claims
- 0849US2016071787A1Semiconductor device attached to an exposed padCHOPIN SHEILA F·Filed 2014·Application pending·0 cites
- 0943US2016064316A1Package substrate with improved reliabilityCARPENTER BURTON J·Filed 2014·Application pending·0 cites
- 1041US9431313B1Integrated circuit carrier coatingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Aug 30, 2016·0 cites·20 claims
- 1139US2015091196A1Mold locks for laminate substratesKOSCHMIEDER THOMAS H·Filed 2013·Application pending·0 cites
- 1237US2014151865A1Semiconductor device packages providing enhanced exposed toe filletsKOSCHMIEDER THOMAS H·Filed 2012·Application pending·0 cites
- 1336US2003102535A1Semiconductor device having a ball grid array and method thereforFiled 2003·Application pending·0 cites
- 1436US2006077029A1Apparatus and method for constructions of stacked inductive componentsFREESCALE SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →