Inventor · disambiguated record
Theron Lee Lewis
Also filed as: LEWIS THERON L · LEWIS THERON LEE
34 granted patents·12 pending applications·58 citations·filing 2006–2023
95Inventor score
Top patents by PatentIndex Score
46 records- 0196US10575448B1Electromagnetic shielding of heat sinks with shape-memory alloy groundingIBM·Filed 2018·Granted Feb 25, 2020·20 cites·20 claims
- 0294US11699884B2Electromagnetic shielding of heatsinks with spring press-fit pinsIBM·Filed 2020·Granted Jul 11, 2023·4 cites·4 claims
- 0389US10756009B1Efficient placement of grid array componentsIBM·Filed 2019·Granted Aug 25, 2020·5 cites·10 claims
- 0477US11784424B2Reliability enhancement of press fit connectorsIBM·Filed 2022·Granted Oct 10, 2023·0 cites·10 claims
- 0576US10262907B1Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2017·Granted Apr 16, 2019·2 cites·13 claims
- 0674US11742602B2Press-fit rework methodIBM·Filed 2022·Granted Aug 29, 2023·0 cites·4 claims
- 0770US11555793B1Anti-vibration fixturing system for nondestructive testingIBM·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0869US11424562B2Press-fit insertion methodIBM·Filed 2020·Granted Aug 23, 2022·0 cites·7 claims
- 0968US12256494B2Modified internal clearance(s) at connector pin aperture(s) of a circuit boardIBM·Filed 2022·Granted Mar 18, 2025·0 cites·25 claims
- 1067US10677856B2Facilitating reliable circuit board press-fit connector assembly fabricationIBM·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 1167US7303443B1Socket and method for compensating for differing coefficients of thermal expansionIBM·Filed 2006·Granted Dec 4, 2007·8 cites·10 claims
- 1266US7472477B2Method for manufacturing a socket that compensates for differing coefficients of thermal expansionIBM·Filed 2006·Granted Jan 6, 2009·8 cites·5 claims
- 1365US11647591B2Compliant pin surface mount technology pad for reworkIBM·Filed 2021·Granted May 9, 2023·0 cites·7 claims
- 1465US11456548B2Reliability enhancement of press fit connectorsIBM·Filed 2019·Granted Sep 27, 2022·0 cites·11 claims
- 1562US10073134B2Laminate bond strength detectionIBM·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
- 1662US9059373B2Protecting a thermal sensitive component in a thermal processIBM·Filed 2012·Granted Jun 16, 2015·1 cites·9 claims
- 1762US7632127B2Socket and method for compensating for differing coefficients of thermal expansionIBM·Filed 2008·Granted Dec 15, 2009·6 cites·6 claims
- 1861US12253354B2Radio frequency identification based three-dimensional metrologyIBM·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 1960US11906574B2Hybrid socket warp indicatorIBM·Filed 2021·Granted Feb 20, 2024·0 cites·7 claims
- 2060US11641717B2Soldering of end chip components in seriesIBM·Filed 2021·Granted May 2, 2023·0 cites·17 claims
- 2159US11733154B2Thermal interface material detection through compressionIBM·Filed 2021·Granted Aug 22, 2023·0 cites·12 claims
- 2259US2025166401A1Hardware integrity validationIBM·Filed 2023·Application pending·0 cites
- 2358US10593601B2Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2019·Granted Mar 17, 2020·0 cites·11 claims
- 2458US9910085B2Laminate bond strength detectionIBM·Filed 2016·Granted Mar 6, 2018·0 cites·20 claims
- 2558US2025007196A1Cantilever contact support using memory metal structureIBM·Filed 2023·Application pending·0 cites
- 2658US2025093106A1Infrared sensor turret for reflow ovensIBM·Filed 2023·Application pending·0 cites
- 2756US11445650B2Localized rework using liquid media solderingIBM·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 2856US2024306347A1Heatsink with phase changing plugs and extinguishing coolantIBM·Filed 2023·Application pending·0 cites
- 2955US12100910B2Shape-memory alloy lock for connectorsIBM·Filed 2021·Granted Sep 24, 2024·0 cites·13 claims
- 3055US2024194558A1Heatsink pedestals for thermal interface material fillIBM·Filed 2022·Application pending·0 cites
- 3155US2024170903A1Controlled extraction of electronic connector from electronic connector boardIBM·Filed 2022·Application pending·0 cites
- 3253US11166401B2Dye and pry process for surface mount technology dual in-line memory moduleIBM·Filed 2019·Granted Nov 2, 2021·0 cites·13 claims
- 3353US2024237228A9Reworking solder component without part removalIBM·Filed 2022·Application pending·0 cites
- 3452US2015362227A1Method and protection apparatus for protecting a thermal sensitive component in a thermal processIBM·Filed 2015·Application pending·0 cites
- 3551US10834839B1Barrier for hybrid socket movement reductionIBM·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 3651US7975379B2Method of making a land-grid-array (LGA) interposerIBM·Filed 2009·Granted Jul 12, 2011·0 cites·8 claims
- 3751US2024232410A1Sensitive data protectionIBM·Filed 2023·Application pending·0 cites
- 3850US11245238B2Tool for shaping contact tab interconnects at a circuit card edgeIBM·Filed 2018·Granted Feb 8, 2022·0 cites·10 claims
- 3950US9402320B2Electronic component assemblyIBM·Filed 2012·Granted Jul 26, 2016·0 cites·6 claims
- 4050US7530853B2Socket and method for compensating for differing coefficients of thermal expansionIBM·Filed 2007·Granted May 12, 2009·2 cites·10 claims
- 4149US11175100B2Heat sinks using memory shaping materialsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·10 claims
- 4248US11211760B2Stutter step press-fit connector insertion processIBM·Filed 2019·Granted Dec 28, 2021·0 cites·7 claims
- 4347US2015276275A1Method and protection apparatus for protecting a thermal sensitive component in a thermal processIBM·Filed 2015·Application pending·0 cites
- 4445US11268809B2Detecting and correcting deficiencies in surface conditions for bonding applicationsIBM·Filed 2018·Granted Mar 8, 2022·0 cites·18 claims
- 4545US2007054512A1Topography compensating land grid array interposerIBM·Filed 2006·Application pending·0 cites
- 4642US2012300423A1Interconnect formation under loadADVOCATE JR GERALD G·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →