Method and protection apparatus for protecting a thermal sensitive component in a thermal process

Abstract

Provided is a method for protecting a thermal sensitive component mounted on a board during a thermal process. The method includes: providing the board, providing a protection apparatus which is removable and made of a thermoelectric material to protect the thermal sensitive component during the thermal process, wherein the protection apparatus cools the thermal sensitive component during the thermal process in response to applying a voltage to the protection apparatus. Further provided is the protection apparatus for the thermal sensitive component mounted on the board during the thermal process.

What is claimed is: 
     
         1 . A protection apparatus for use with a thermal sensitive component disposed on a board during a thermal process, comprising:
 a removable device body having a void for containing at least a portion of the thermal sensitive component, the removable device body comprises a thermoelectric material, and the removable device body is structured to protect the thermal sensitive component during the thermal process; and   a battery for supplying a voltage to the removable device body to thereby enable the protection apparatus to cool the thermal sensitive component.   
     
     
         2 . The protection apparatus of  claim 2 , wherein the thermal process is one of a wave soldering process, an SMT reflow process, a hand soldering process, and a rework process. 
     
     
         3 . The protection apparatus of  claim 2 , wherein the thermal process is a wave soldering process that occurs at 90° C. to 260° C. and uses the board with a through hole penetrable by a solder connection on the thermal sensitive component, or is an SMT reflow process that occurs at 183° C. to 260° C. and uses the board further comprising electronic components mounted thereon by the SMT reflow process. 
     
     
         4 . The protection apparatus of  claim 2 , wherein the removable device body comprises a second body portion and a first body portion disposed on the second body portion, wherein one of the first body portion and the second body portion is made of an P-type thermoelectric material, wherein the other one of the first body portion and the second body portion is made of an N-type thermoelectric material. 
     
     
         5 . The protection apparatus of  claim 2 , wherein the removable device body comprises a first substrate body, a second substrate body, an P-type thermoelectric material chip and an N-type thermoelectric material chip which are disposed between the first substrate body and the second substrate body, and an electrode of an PN junction, wherein the first substrate body and the second substrate body are hermetically sealed to define a hermetically sealed space. 
     
     
         6 . The protection apparatus of  claim 5 , wherein the hermetically sealed space of the protection apparatus is under vacuum before the protection apparatus starts to protect the thermal sensitive component.