Inventor · disambiguated record
Theng Chao Long
Also filed as: LONG THENG CHAO
12 granted patents·3 pending applications·13 citations·filing 2013–2022
83Inventor score
Top patents by PatentIndex Score
15 records- 0181US9837380B2Semiconductor device having multiple contact clipsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
- 0265US9655265B2Electronic moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 16, 2017·3 cites·14 claims
- 0364US10396018B2Multi-phase half bridge driver package and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·1 cites·13 claims
- 0458US9490199B2Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangementsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 8, 2016·2 cites·19 claims
- 0555US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 0654US12094807B2Stacked transistor chip package with source couplingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 17, 2024·0 cites·16 claims
- 0749US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0846US9892991B2Connectable package extender for semiconductor device packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 13, 2018·0 cites·14 claims
- 0945US9508625B2Semiconductor die package with multiple mounting configurationsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 29, 2016·0 cites·33 claims
- 1043US9594111B2Turret handlers and methods of operations thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 14, 2017·0 cites·14 claims
- 1142US9666557B2Small footprint semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 30, 2017·0 cites·26 claims
- 1242US9484280B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Nov 1, 2016·0 cites·14 claims
- 1342US2018102300A1Connectable Package Extender for Semiconductor Device PackageINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1441US2015214179A1Semiconductor device including flexible leadsINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 1535US9153518B2Molded semiconductor package with pluggable leadINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 6, 2015·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →