Inventor · disambiguated record
Thomas Marieb
Also filed as: MARIEB THOMAS · MARIEB THOMAS N · MARIEB THOMAS N D
17 granted patents·2 pending applications·480 citations·filing 1996–2018
95Inventor score
Top patents by PatentIndex Score
19 records- 0193US8421225B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2012·Granted Apr 16, 2013·14 cites·8 claims
- 0290US6309956B1Fabricating low K dielectric interconnect systems by using dummy structures to enhance processINTEL CORP·Filed 1999·Granted Oct 30, 2001·138 cites·6 claims
- 0388US6800554B2Copper alloys for interconnections having improved electromigration characteristics and methods of making sameINTEL CORP·Filed 2000·Granted Oct 5, 2004·47 cites·7 claims
- 0487US7973407B2Three-dimensional stacked substrate arrangementsINTEL CORP·Filed 2008·Granted Jul 5, 2011·12 cites·12 claims
- 0585US6525419B1Thermally coupling electrically decoupling cooling device for integrated circuitsINTEL CORP·Filed 2002·Granted Feb 25, 2003·45 cites·10 claims
- 0685US6303464B1Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layerINTEL CORP·Filed 1996·Granted Oct 16, 2001·87 cites·8 claims
- 0781US6838299B2Forming defect prevention trenches in dicing streetsINTEL CORP·Filed 2001·Granted Jan 4, 2005·27 cites·20 claims
- 0880US8203208B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2011·Granted Jun 19, 2012·4 cites·7 claims
- 0973US6646340B2Thermally coupling electrically decoupling cooling device for integrated circuitsINTEL CORP·Filed 2003·Granted Nov 11, 2003·21 cites·50 claims
- 1072US7220674B2Copper alloys for interconnections having improved electromigration characteristics and methods of making sameINTEL CORP·Filed 2004·Granted May 22, 2007·15 cites·13 claims
- 1170US6794755B2Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvementINTEL CORP·Filed 2003·Granted Sep 21, 2004·11 cites·6 claims
- 1268US6977220B2Copper alloys for interconnections having improved electromigration characteristics and methods of making sameINTEL CORP·Filed 2004·Granted Dec 20, 2005·12 cites·10 claims
- 1363US6740427B2Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making sameINTEL CORP·Filed 2001·Granted May 25, 2004·13 cites·25 claims
- 1456US5909635ACladding of an interconnect for improved electromigration performanceINTEL CORP·Filed 1996·Granted Jun 1, 1999·21 cites·38 claims
- 1547US6100709ASilicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shapeINTEL CORP·Filed 1998·Granted Aug 8, 2000·13 cites·18 claims
- 1640US11749560B2Cladded metal interconnectsINTEL CORP·Filed 2018·Granted Sep 5, 2023·0 cites·19 claims
- 1740US2005003650A1Three-dimensional stacked substrate arrangementsFiled 2003·Application pending·0 cites
- 1840US2004056366A1A method of forming surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvementFiled 2002·Application pending·0 cites
- 1930US6777810B2Interconnection alloy for integrated circuitsINTEL CORP·Filed 1999·Granted Aug 17, 2004·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →