Inventor · disambiguated record
Thomas Ort
Also filed as: ORT THOMAS
15 granted patents·7 pending applications·10 citations·filing 2006–2025
87Inventor score
Top patents by PatentIndex Score
22 records- 0188US2025309017A1Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2025·Application pending·0 cites
- 0285US12362251B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0383US2024355697A1Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2024·Application pending·0 cites
- 0482US10867934B2Component magnetic shielding for microelectronic devicesINTEL IP CORP·Filed 2018·Granted Dec 15, 2020·4 cites·12 claims
- 0582US10546817B2Face-up fan-out electronic package with passive components using a supportINTEL IP CORP·Filed 2017·Granted Jan 28, 2020·2 cites·12 claims
- 0681US12057364B2Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 0781US10665522B2Package including an integrated routing layer and a molded routing layerINTEL IP CORP·Filed 2017·Granted May 26, 2020·2 cites·13 claims
- 0878US11955395B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·18 claims
- 0972US11404339B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 1071US11508637B2Fan out package and methodsINTEL CORP·Filed 2020·Granted Nov 22, 2022·0 cites·19 claims
- 1170US10403580B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2017·Granted Sep 3, 2019·1 cites·20 claims
- 1268US2022051990A1Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2021·Application pending·0 cites
- 1366US11211337B2Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 1461US8598709B2Method and system for routing electrical connections of semiconductor chipsMEYER THORSTEN·Filed 2010·Granted Dec 3, 2013·1 cites·24 claims
- 1560US10699980B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 1656US10720393B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2019·Granted Jul 21, 2020·0 cites·20 claims
- 1750US12497940B2Method of refurbishing an energy conversion facility and refurbished energy conversion facilityVOITH PATENT GMBH·Filed 2024·Granted Dec 16, 2025·0 cites·11 claims
- 1845US2020158073A1Runner for a hydroelectric axial turbine or pumpVOITH PATENT GMBH·Filed 2018·Application pending·0 cites
- 1942US11764187B2Semiconductor packages, and methods for forming semiconductor packagesINTEL CORP·Filed 2017·Granted Sep 19, 2023·0 cites·14 claims
- 2041US2007018308A1Electronic component and electronic configurationSCHOTT ALBERT·Filed 2006·Application pending·0 cites
- 2140US2013256883A1Rotated semiconductor device fan-out wafer level packages and methods of manufacturing rotated semiconductor device fan-out wafer level packagesMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 2238US2019214327A1Thermal conduction devices and methods for embedded electronic devicesKOLLER SONJA·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →