Inventor · disambiguated record
Thiagarajan Raman
Also filed as: RAMAN THIAGARAJAN
4 granted patents·7 pending applications·2 citations·filing 2018–2025
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0190US11824025B2Apparatus including integrated pads and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 21, 2023·2 cites·20 claims
- 0277US12300647B2Apparatus including integrated pads and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0375US2025266381A1Apparatus including integrated pads and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0453US2024055400A1Substrate for vertically assembled semiconductor diesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0551US2024079369A1Connecting semiconductor dies through tracesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0650US2024055397A1Through-substrate connections for recessed semiconductor diesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0746US10566300B2Bond pads with surrounding fill linesGLOBALFOUNDRIES INC·Filed 2018·Granted Feb 18, 2020·0 cites·19 claims
- 0845US2024071914A1Semiconductor device assemblies with coplanar interconnect structures, and methods for making the sameMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0945US2024071891A1Semiconductor device assemblies having face-to-face subassemblies, and methods for making the sameMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1045US2024047396A1Bonded semiconductor deviceMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1143US11676932B2Semiconductor interconnect structures with narrowed portions, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 13, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →