Inventor · disambiguated record
Thomas B. Richardson
Also filed as: RICHARDSON THOMAS · RICHARDSON THOMAS B
19 granted patents·4 pending applications·65 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
23 records- 0194US7670950B2Copper metallization of through silicon viaENTHONE·Filed 2008·Granted Mar 2, 2010·43 cites·21 claims
- 0285US8986434B2Silver plating in electronics manufactureENTHONE·Filed 2013·Granted Mar 24, 2015·2 cites·20 claims
- 0384US11384446B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2020·Granted Jul 12, 2022·1 cites·12 claims
- 0482US2024110306A1Compositions and Methods for the Electrodeposition of Nanotwinned CopperMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0580US11873568B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Granted Jan 16, 2024·0 cites·15 claims
- 0679US7713859B2Tin-silver solder bumping in electronics manufactureENTHONE·Filed 2006·Granted May 11, 2010·12 cites·28 claims
- 0777US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0877US9212427B2Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substratesSchäfer Stefan·Filed 2007·Granted Dec 15, 2015·2 cites·20 claims
- 0976US10519557B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Granted Dec 31, 2019·2 cites·28 claims
- 1069US12398480B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 26, 2025·0 cites·15 claims
- 1168US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 1265US9657402B2Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substratesENTHONE·Filed 2015·Granted May 23, 2017·0 cites·19 claims
- 1363US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 1459US11168406B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2019·Granted Nov 9, 2021·0 cites·31 claims
- 1557US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 1657US8349393B2Silver plating in electronics manufactureENTHONE·Filed 2004·Granted Jan 8, 2013·2 cites·49 claims
- 1754US9730321B2Silver plating in electronics manufactureENTHONE·Filed 2015·Granted Aug 8, 2017·0 cites·20 claims
- 1850US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 1949US2024318342A1Compositions and methods for the eletrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 2040US10541140B2Process for filling vias in the microelectronicsRICHARDSON THOMAS B·Filed 2012·Granted Jan 21, 2020·0 cites·24 claims
- 2139US10294574B2Levelers for copper deposition in microelectronicsMACDERMID ENTHONE INC·Filed 2015·Granted May 21, 2019·0 cites·9 claims
- 2236US2018355502A1Process for metalization of copper pillars in the manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 2333US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Thomas B. Richardson files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →