Inventor · disambiguated record
Thorsten Scharf
Also filed as: SCHARF THORSTEN
45 granted patents·25 pending applications·68 citations·filing 2005–2025
96Inventor score
Files withINFINEON TECHNOLOGIES AG51INFINEON TECHNOLOGIES AUSTRIA AG6SCHARF THORSTEN4CLAAS FRANCE SAS3INFINEON TECHNOLOGIES DRESDEN GMBH2
Top patents by PatentIndex Score
70 records- 0192US11862600B2Method of forming a chip package and chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·2 cites·22 claims
- 0289US10903180B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 26, 2021·4 cites·14 claims
- 0389US10629575B1Stacked die semiconductor package with electrical interposerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 21, 2020·6 cites·20 claims
- 0488US12431450B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0588US12249561B2Semiconductor device arrangement with compressible adhesiveINFINEON TECHNOLOGIES AG·Filed 2022·Granted Mar 11, 2025·1 cites·20 claims
- 0687US11600558B2Plurality of transistor packages with exposed source and drain contacts mounted on a carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 7, 2023·2 cites·14 claims
- 0783US8177878B2Bonding material with exothermically reactive heterostructuresHEINRICH ALEXANDER·Filed 2009·Granted May 15, 2012·15 cites·15 claims
- 0881US12027481B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 2, 2024·0 cites·22 claims
- 0981US12027490B2Semiconductor device and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 2, 2024·1 cites·15 claims
- 1081US10056348B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 21, 2018·2 cites·15 claims
- 1181US9773719B2Semiconductor packages and methods of fabrication thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2012·Granted Sep 26, 2017·5 cites·24 claims
- 1280US12394697B2Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screwINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Aug 19, 2025·0 cites·13 claims
- 1380US11469161B2Lead frame-based semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·1 cites·23 claims
- 1477US12218098B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1577US9357709B2Combination of a towing vehicle and an agricultural harvesting machine drawn thereby including a control device for specifying a ground speed of the combinationCLAAS KGAA MBH·Filed 2014·Granted Jun 7, 2016·8 cites·18 claims
- 1676US2025062290A1Power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1775US9941229B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 10, 2018·2 cites·17 claims
- 1874US11569186B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 31, 2023·0 cites·22 claims
- 1974US10062671B2Circuit board embedding a power semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 28, 2018·2 cites·13 claims
- 2073US11915999B2Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling elementINFINEON TECHNOLOGIES AG·Filed 2023·Granted Feb 27, 2024·0 cites·20 claims
- 2173US9437516B2Chip-embedded packages with backside die connectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Sep 6, 2016·3 cites·20 claims
- 2272US12211824B2Power semiconductor package having first and second lead framesINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·15 claims
- 2372US11309277B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 2470US10971457B2Semiconductor device comprising a composite material clipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·1 cites·20 claims
- 2570US10325834B2Semiconductor packages and methods of fabrication thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Jun 18, 2019·1 cites·22 claims
- 2670US7770744B2Rope winding system for winding and unwinding steel ropes of cranesTEREX DEMAG GMBH·Filed 2005·Granted Aug 10, 2010·10 cites·26 claims
- 2769US11955415B2Semiconductor device package comprising a pin in the form of a drilling screwINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 2869US10886186B2Semiconductor package systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·24 claims
- 2968US9263425B2Semiconductor device including multiple semiconductor chips and a laminateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Feb 16, 2016·1 cites·22 claims
- 3067US2023361087A1Molded power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3166US2025174509A1Encapsulated package with carrier, laminate body and component in betweenINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 3262US2023051100A1Semiconductor package having a lead frame and a clip frameINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3361US10734351B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 4, 2020·0 cites·19 claims
- 3461US2024332142A1Power semiconductor module with adaptable power contacts and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3561US2024347369A1Dissolving adhesive base structure to release electronic componentINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3661US2025323184A1Molded Electronic Component Having a Shunt Between a Load Terminal and a Sense TerminalINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3759US2024105678A1Chip package, method of forming a chip package, and chip systemINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3859US2025118614A1Molded package and power module with temperature sense cavityINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3959US2021035879A1Encapsulated package with carrier, laminate body and component in betweenINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 4058US2025079275A1Package with transistor chip between carrier and conductive structure and with thermally conductive electrically insulating layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4155US11515244B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 4255US2021217633A1Semiconductor device having a semiconductor die embedded in a molding compoundINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 4354US12154886B2Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 26, 2024·0 cites·9 claims
- 4454US2024030200A1Semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 4554US2023197577A1Semiconductor Devices Including a Premolded Leadframe and a Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 4654US2024039421A1Multi-phase power converterINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 4753US11502042B2Processing of one or more carrier bodies and electronic components by multiple alignmentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 15, 2022·0 cites·16 claims
- 4853US11004700B2Temporary post-assisted embedding of semiconductor diesINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 11, 2021·0 cites·23 claims
- 4953US2024332136A1Power semiconductor device with a stress-free joint between metal parts and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 5053US2024395676A1Package with Single Integral Body Carrying Two Transistor Chips with Half Bridge ConfigurationINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →