Inventor · disambiguated record
Thomas M. Shaw
Also filed as: SHAW THOMAS M · SHAW THOMAS MCCARROLL
88 granted patents·15 pending applications·1,544 citations·filing 1991–2019
99Inventor score
Top patents by PatentIndex Score
103 records- 0198US7955955B2Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structuresIBM·Filed 2007·Granted Jun 7, 2011·70 cites·22 claims
- 0298US6090659ALead silicate based capacitor structuresIBM·Filed 1999·Granted Jul 18, 2000·397 cites·3 claims
- 0397US7381659B2Method for reducing film stress for SiCOH low-k dielectric materialsIBM·Filed 2005·Granted Jun 3, 2008·49 cites·20 claims
- 0496US9586857B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2015·Granted Mar 7, 2017·13 cites·20 claims
- 0595US7973409B2Hybrid interconnect structure for performance improvement and reliability enhancementIBM·Filed 2007·Granted Jul 5, 2011·24 cites·9 claims
- 0695US7402532B2Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layerIBM·Filed 2006·Granted Jul 22, 2008·28 cites·1 claims
- 0794US8242600B2Redundant metal barrier structure for interconnect applicationsYANG CHIH-CHAO·Filed 2009·Granted Aug 14, 2012·26 cites·19 claims
- 0894US8076756B2Structure for inhibiting back end of line damage from dicing and chip packaging interaction failuresLANE MICHAEL W·Filed 2011·Granted Dec 13, 2011·21 cites·20 claims
- 0991US8129286B2Reducing effective dielectric constant in semiconductor devicesEDELSTEIN DANIEL C·Filed 2008·Granted Mar 6, 2012·11 cites·32 claims
- 1091US7892940B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Feb 22, 2011·11 cites·25 claims
- 1191US7405147B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2004·Granted Jul 29, 2008·35 cites·31 claims
- 1290US9059167B2Structure and method for making crack stop for 3D integrated circuitsIBM·Filed 2014·Granted Jun 16, 2015·8 cites·17 claims
- 1389US8859390B2Structure and method for making crack stop for 3D integrated circuitsFAROOQ MUKTA G·Filed 2010·Granted Oct 14, 2014·9 cites·10 claims
- 1489US8796854B2Hybrid interconnect structure for performance improvement and reliability enhancementIBM·Filed 2013·Granted Aug 5, 2014·6 cites·19 claims
- 1589US8343868B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2011·Granted Jan 1, 2013·6 cites·20 claims
- 1689US7098676B2Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitorIBM·Filed 2003·Granted Aug 29, 2006·49 cites·12 claims
- 1789US6417572B1Process for producing metal interconnections and product produced therebyIBM·Filed 1999·Granted Jul 9, 2002·105 cites·21 claims
- 1888US7357977B2Ultralow dielectric constant layer with controlled biaxial stressIBM·Filed 2005·Granted Apr 15, 2008·10 cites·7 claims
- 1988US7067902B2Building metal pillars in a chip for structure supportIBM·Filed 2003·Granted Jun 27, 2006·42 cites·10 claims
- 2087US9874601B2Integrated time dependent dielectric breakdown reliability testingIBM·Filed 2016·Granted Jan 23, 2018·2 cites·19 claims
- 2187US7592685B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Sep 22, 2009·7 cites·20 claims
- 2286US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 2385US9472368B2Piezoelectronic switch device for RF applicationsIBM·Filed 2014·Granted Oct 18, 2016·4 cites·16 claims
- 2485US7109093B2Crackstop with release layer for crack control in semiconductorsIBM·Filed 2004·Granted Sep 19, 2006·32 cites·19 claims
- 2585US6255122B1Amorphous dielectric capacitors on siliconIBM·Filed 1999·Granted Jul 3, 2001·45 cites·26 claims
- 2684US9738560B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 2784US6202191B1Electromigration resistant power distribution networkIBM·Filed 1999·Granted Mar 13, 2001·83 cites·46 claims
- 2883US8592306B2Redundant metal barrier structure for interconnect applicationsYANG CHIH-CHAO·Filed 2012·Granted Nov 26, 2013·5 cites·18 claims
- 2982US7102232B2Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layerIBM·Filed 2004·Granted Sep 5, 2006·19 cites·13 claims
- 3082US6972209B2Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2002·Granted Dec 6, 2005·32 cites·8 claims
- 3182US6088216ALead silicate based capacitor structuresIBM·Filed 1995·Granted Jul 11, 2000·50 cites·7 claims
- 3281US9082781B2Semiconductor article having a zig-zag guard ring and method of forming the sameIBM·Filed 2013·Granted Jul 14, 2015·5 cites·19 claims
- 3381US7745863B2Flip FERAM cell and method to form sameIBM·Filed 2008·Granted Jun 29, 2010·5 cites·15 claims
- 3480US8754526B2Hybrid interconnect structure for performance improvement and reliability enhancementIBM·Filed 2013·Granted Jun 17, 2014·3 cites·16 claims
- 3580US7491578B1Method of forming crack trapping and arrest in thin film structuresIBM·Filed 2008·Granted Feb 17, 2009·8 cites·1 claims
- 3680US7456098B2Building metal pillars in a chip for structure supportIBM·Filed 2006·Granted Nov 25, 2008·8 cites·8 claims
- 3779US7388224B2Structure for determining thermal cycle reliabilityIBM·Filed 2006·Granted Jun 17, 2008·4 cites·14 claims
- 3879US6333202B1Flip FERAM cell and method to form sameIBM·Filed 1999·Granted Dec 25, 2001·27 cites·27 claims
- 3978US9018089B2Multiple step anneal method and semiconductor formed by multiple step annealLINIGER ERIC G·Filed 2011·Granted Apr 28, 2015·6 cites·21 claims
- 4077US7820559B2Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layerIBM·Filed 2008·Granted Oct 26, 2010·4 cites·19 claims
- 4176US6388285B1Feram cell with internal oxygen source and method of oxygen releaseIBM·Filed 1999·Granted May 14, 2002·30 cites·30 claims
- 4275US8456006B2Hybrid interconnect structure for performance improvement and reliability enhancementYANG CHIH-CHAO·Filed 2011·Granted Jun 4, 2013·2 cites·20 claims
- 4374US9448277B2Integrated time dependent dielectric breakdown reliability testingCHEN JIFENG·Filed 2012·Granted Sep 20, 2016·2 cites·7 claims
- 4474US7573130B1Crack trapping and arrest in thin film structuresIBM·Filed 2009·Granted Aug 11, 2009·5 cites·1 claims
- 4574US7485582B2Hardmask for improved reliability of silicon based dielectricsIBM·Filed 2008·Granted Feb 3, 2009·5 cites·13 claims
- 4674US7335980B2Hardmask for reliability of silicon based dielectricsIBM·Filed 2004·Granted Feb 26, 2008·12 cites·13 claims
- 4770US10168143B2Strain monitoring of MRAM arraysIBM·Filed 2017·Granted Jan 1, 2019·1 cites·6 claims
- 4870US8362596B2Engineered interconnect dielectric caps having compressive stress and interconnect structures containing sameIBM·Filed 2009·Granted Jan 29, 2013·4 cites·24 claims
- 4970US7847402B2BEOL interconnect structures with improved resistance to stressIBM·Filed 2007·Granted Dec 7, 2010·4 cites·13 claims
- 5070US7303994B2Process for interfacial adhesion in laminate structures through patterned roughing of a surfaceIBM·Filed 2004·Granted Dec 4, 2007·10 cites·5 claims
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →