Inventor · disambiguated record
Thomas Weiss
Also filed as: WEISS THOMAS · WEISS THOMAS J · WEISS THOMAS M
87 granted patents·15 pending applications·721 citations·filing 1984–2024
99Inventor score
Files withIBM74AUTHENTIC VISION GMBH12GLOBALFOUNDRIES INC2KONINKL PHILIPS ELECTRONICS NV2WEISS THOMAS2
Top patents by PatentIndex Score
102 records- 0199US9578764B1Enclosure with inner tamper-respondent sensor(s) and physical security element(s)IBM·Filed 2015·Granted Feb 21, 2017·40 cites·19 claims
- 0298US9717154B2Enclosure with inner tamper-respondent sensor(s)IBM·Filed 2017·Granted Jul 25, 2017·34 cites·18 claims
- 0398US9661747B1Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2016·Granted May 23, 2017·43 cites·15 claims
- 0498US9591776B1Enclosure with inner tamper-respondent sensor(s)IBM·Filed 2015·Granted Mar 7, 2017·39 cites·18 claims
- 0598US9554477B1Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2015·Granted Jan 24, 2017·48 cites·16 claims
- 0697US9877383B2Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2017·Granted Jan 23, 2018·17 cites·12 claims
- 0797US9555606B1Applying pressure to adhesive using CTE mismatch between componentsIBM·Filed 2015·Granted Jan 31, 2017·36 cites·17 claims
- 0896US9913370B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2016·Granted Mar 6, 2018·14 cites·18 claims
- 0996US9913362B2Tamper-respondent assemblies with bond protectionIBM·Filed 2015·Granted Mar 6, 2018·13 cites·10 claims
- 1096US9894749B2Tamper-respondent assemblies with bond protectionIBM·Filed 2015·Granted Feb 13, 2018·15 cites·18 claims
- 1195US11235404B2Personalized copper block for selective solder removalIBM·Filed 2020·Granted Feb 1, 2022·4 cites·14 claims
- 1295US9999124B2Tamper-respondent assemblies with trace regions of increased susceptibility to breakingIBM·Filed 2016·Granted Jun 12, 2018·15 cites·20 claims
- 1395US9913416B2Enclosure with inner tamper-respondent sensor(s) and physical security element(s)IBM·Filed 2015·Granted Mar 6, 2018·11 cites·11 claims
- 1495US9089052B2Multichip module with stiffening frame and associated coversIBM·Filed 2014·Granted Jul 21, 2015·17 cites·8 claims
- 1590US6529021B1Self-scrub buckling beam probeIBM·Filed 2000·Granted Mar 4, 2003·54 cites·16 claims
- 1689US10172232B2Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2017·Granted Jan 1, 2019·4 cites·13 claims
- 1788US10424527B2Electronic package with tapered pedestalIBM·Filed 2017·Granted Sep 24, 2019·5 cites·20 claims
- 1888US10178818B2Enclosure with inner tamper-respondent sensor(s) and physical security element(s)IBM·Filed 2017·Granted Jan 8, 2019·4 cites·20 claims
- 1988US6532654B2Method of forming an electrical connectorIBM·Filed 2001·Granted Mar 18, 2003·38 cites·24 claims
- 2088US4549134AMoisture probe and techniqueDOW CHEMICAL CO·Filed 1984·Granted Oct 22, 1985·50 cites·29 claims
- 2187US11282773B2Enlarged conductive pad structures for enhanced chip bond assembly yieldIBM·Filed 2020·Granted Mar 22, 2022·2 cites·13 claims
- 2287US9913389B2Tamper-respondent assembly with vent structureIBM·Filed 2015·Granted Mar 6, 2018·5 cites·18 claims
- 2387US9875986B2Micro-scrub process for fluxless micro-bump bondingIBM·Filed 2016·Granted Jan 23, 2018·6 cites·12 claims
- 2486US11228124B1Connecting a component to a substrate by adhesion to an oxidized solder surfaceIBM·Filed 2021·Granted Jan 18, 2022·1 cites·14 claims
- 2585US9089051B2Multichip module with stiffening frame and associated coversIBM·Filed 2013·Granted Jul 21, 2015·6 cites·12 claims
- 2684US10257924B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2017·Granted Apr 9, 2019·3 cites·19 claims
- 2784US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 2883US9548863B2Method for unambiguous marking of an objectAUTHENTIC VISION GMBH·Filed 2013·Granted Jan 17, 2017·7 cites·23 claims
- 2983US7887874B2Fully automated paste dispense system for dispensing small dots and linesIBM·Filed 2007·Granted Feb 15, 2011·7 cites·10 claims
- 3082US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 3182US10327343B2Applying pressure to adhesive using CTE mismatch between componentsIBM·Filed 2016·Granted Jun 18, 2019·2 cites·19 claims
- 3280US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 3379US10177075B2Liquid cooled compliant heat sink and related methodIBM·Filed 2016·Granted Jan 8, 2019·2 cites·6 claims
- 3479US9048245B2Method for shaping a laminate substrateBLACKSHEAR EDMUND·Filed 2012·Granted Jun 2, 2015·5 cites·20 claims
- 3579US7510619B2Greensheet via repair/fill toolIBM·Filed 2005·Granted Mar 31, 2009·6 cites·4 claims
- 3677US10586782B2Lead-free solder joining of electronic structuresIBM·Filed 2017·Granted Mar 10, 2020·2 cites·25 claims
- 3777US10264665B2Tamper-respondent assemblies with bond protectionIBM·Filed 2017·Granted Apr 16, 2019·1 cites·18 claims
- 3876US10833051B2Precision alignment of multi-chip high density interconnectsIBM·Filed 2019·Granted Nov 10, 2020·2 cites·20 claims
- 3975US10756031B1Decoupling capacitor stiffenerIBM·Filed 2019·Granted Aug 25, 2020·2 cites·18 claims
- 4075US7119421B2Quad flat non-leaded package comprising a semiconductor deviceKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Granted Oct 10, 2006·31 cites·5 claims
- 4175US6389940B1Gang punch tool assemblyIBM·Filed 2001·Granted May 21, 2002·17 cites·8 claims
- 4274US8297222B2Fully automated paste dispense system for dispensing small dots and linesWEISS THOMAS·Filed 2007·Granted Oct 30, 2012·2 cites·20 claims
- 4374US2022274436A1Object Marking for Optical Authentication and Method for Producing SameAUTHENTIC VISION GMBH·Filed 2022·Application pending·0 cites
- 4473US11390107B2Object marking for optical authentication and method for producing sameAUTHENTIC VISION GMBH·Filed 2020·Granted Jul 19, 2022·0 cites·20 claims
- 4573US7894919B2Fully automated paste dispense system for dispensing small dots and linesIBM·Filed 2007·Granted Feb 22, 2011·3 cites·11 claims
- 4672US10251288B2Tamper-respondent assembly with vent structureIBM·Filed 2017·Granted Apr 2, 2019·1 cites·20 claims
- 4772US7401637B2Pressure-only molten metal valving apparatus and methodIBM·Filed 2006·Granted Jul 22, 2008·3 cites·20 claims
- 4872US6565496B1Fully automated precision punch head loader for universal gang-punch toolIBM·Filed 2002·Granted May 20, 2003·17 cites·10 claims
- 4971US12130954B2Method for producing a security deviceAUTHENTIC VISION GMBH·Filed 2023·Granted Oct 29, 2024·0 cites·14 claims
- 5071US11031373B2Spacer for die-to-die communication in an integrated circuitIBM·Filed 2019·Granted Jun 8, 2021·1 cites·18 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →