Inventor · disambiguated record

Timothy Blomgren

Also filed as: BLOMGREN TIMOTHY

2 granted patents·58 citations·filing 2004–2008

63Inventor score

Technology areasG01R H10P

Files withKLA TENCOR TECH CORP1 YASUMURA KEVIN Y1

Top patents by PatentIndex Score

2 records

0187US7292427B1Pin lift chuck assembly for warped substratesKLA TENCOR TECH CORP·Filed 2004·Granted Nov 6, 2007·52 cites·27 claims
0262US8324915B2Increasing thermal isolation of a probe card assemblyYASUMURA KEVIN Y·Filed 2008·Granted Dec 4, 2012·6 cites·28 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →