Inventor · disambiguated record
Tien-Chang Chang
Also filed as: CHANG TIEN C · CHANG TIEN-CHANG
15 granted patents·7 pending applications·111 citations·filing 1994–2021
91Inventor score
Top patents by PatentIndex Score
22 records- 0190US7667302B1Integrated circuit chip with seal ring structureMEDIATEK INC·Filed 2008·Granted Feb 23, 2010·23 cites·14 claims
- 0289US7671469B2SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effectMEDIATEK INC·Filed 2007·Granted Mar 2, 2010·16 cites·13 claims
- 0387US8212323B2Seal ring structure for integrated circuitsLEE TUNG-HSING·Filed 2010·Granted Jul 3, 2012·9 cites·25 claims
- 0483US8242586B2Integrated circuit chip with seal ring structureCHANG TIEN-CHANG·Filed 2009·Granted Aug 14, 2012·12 cites·16 claims
- 0582US8138616B2Bond pad structureCHANG TIEN-CHANG·Filed 2008·Granted Mar 20, 2012·12 cites·22 claims
- 0675US8476745B2Integrated circuit chip with reduced IR dropTU CHAO-CHUN·Filed 2009·Granted Jul 2, 2013·9 cites·19 claims
- 0766US5434096AMethod to prevent silicide bubble in the VLSI processTAIWAN SEMICONDUCTOR MFG·Filed 1994·Granted Jul 18, 1995·28 cites·28 claims
- 0860US8587090B2Die seal ring structureCHANG TIEN-CHANG·Filed 2012·Granted Nov 19, 2013·1 cites·22 claims
- 0958US8669619B2Semiconductor structure with multi-layer contact etch stop layer structureCHANG TIEN-CHANG·Filed 2010·Granted Mar 11, 2014·1 cites·18 claims
- 1057US9455226B2Semiconductor device allowing metal layer routing formed directly under metal padMEDIATEK INC·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 1156US9847294B2Semiconductor device allowing metal layer routing formed directly under metal padMEDIATEK INC·Filed 2017·Granted Dec 19, 2017·0 cites·18 claims
- 1255US9627336B2Semiconductor device allowing metal layer routing formed directly under metal padMEDIATEK INC·Filed 2016·Granted Apr 18, 2017·0 cites·18 claims
- 1353US11854924B2Semiconductor package with improved reliabilityMEDIATEK INC·Filed 2021·Granted Dec 26, 2023·0 cites·10 claims
- 1452US8188578B2Seal ring structure for integrated circuitsLEE TUNG-HSING·Filed 2008·Granted May 29, 2012·0 cites·25 claims
- 1550US2009294897A1Seal ring structure for integrated circuitsLEE TUNG-HSING·Filed 2008·Application pending·0 cites
- 1646US8766417B2Integrated circuit chip with reduced IR dropMEDIATEK INC·Filed 2013·Granted Jul 1, 2014·0 cites·18 claims
- 1746US2014175608A1Method for including decoupling capacitors into semiconductor circuit having logic circuit therein and semiconductor circuit thereofMEDIATEK INC·Filed 2014·Application pending·0 cites
- 1845US2010065943A1Method for including decoupling capacitors into semiconductor circuit having logic circuit therein and semiconductor circuit thereofCHANG TIEN-CHANG·Filed 2008·Application pending·0 cites
- 1942US2009057907A1Interconnection structureYANG MING-TZONG·Filed 2007·Application pending·0 cites
- 2039US2015001675A1Method for including decoupling capacitors into semiconductor circuit having logic circuit therein and semiconductor circuit thereofMEDIATEK INC·Filed 2014·Application pending·0 cites
- 2139US2009215277A1Dual contact etch stop layer processLEE TUNG-HSING·Filed 2008·Application pending·0 cites
- 2235US2002109105A1Method of ion implantationFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →