Inventor · disambiguated record
Tianbao Du
Also filed as: DU TIANBAO
2 granted patents·8 pending applications·23 citations·filing 2005–2008
58Inventor score
Top patents by PatentIndex Score
10 records- 0191US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 0264US7390429B2Method and composition for electrochemical mechanical polishing processingAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·3 cites·13 claims
- 0344US2007290166A1Method and composition for polishing a substrateLIU FENG Q·Filed 2007·Application pending·0 cites
- 0443US2006169597A1Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0541US2007251832A1Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearanceAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0640US2007187258A1Method for electrochemically polishing a conductive material on a substrateDU TIANBAO·Filed 2006·Application pending·0 cites
- 0739US2010038584A1Polishing Composition and Polishing Method Using the SameFUJIMI INC·Filed 2008·Application pending·0 cites
- 0838US2007219103A1Novel rinse solution to remove cross-contaminationAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0938US2007227902A1Removal profile tuning by adjusting conditioning sweep profile on a conductive padAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1036US2007235345A1Polishing method that suppresses hillock formationAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →