Inventor · disambiguated record
Timothy L. Jackson
Also filed as: JACKSON TIMOTHY · JACKSON TIMOTHY L
25 granted patents·1 pending application·2,396 citations·filing 1990–2009
97Inventor score
Files withMICRON TECHNOLOGY INC19ADVANCED MICRO DEVICES INC4MASSAM PETER DAVID1MICRONTECHNOLOGY INC1
Top patents by PatentIndex Score
26 records- 0198US7355273B2Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 8, 2008·455 cites·31 claims
- 0298US6962867B2Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereofMICRONTECHNOLOGY INC·Filed 2003·Granted Nov 8, 2005·600 cites·28 claims
- 0398US6800930B2Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 5, 2004·621 cites·68 claims
- 0498US6506681B2Thin flip—chip methodMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 14, 2003·197 cites·84 claims
- 0596US7217596B2Stacked die module and techniques for forming a stacked die moduleMICRON TECHNOLOGY INC·Filed 2004·Granted May 15, 2007·92 cites·15 claims
- 0695US6285081B1Deflectable interconnectMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 4, 2001·77 cites·23 claims
- 0792US7811903B2Thin flip-chip methodMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 12, 2010·18 cites·19 claims
- 0891US7291543B2Thin flip-chip methodMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 6, 2007·17 cites·35 claims
- 0990US6664131B2Method of making ball grid array package with deflectable interconnectMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 16, 2003·34 cites·16 claims
- 1087US6905946B2Thin flip-chip methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·33 cites·84 claims
- 1186US6244064B1Combination toolbox-cooler deviceFiled 1999·Granted Jun 12, 2001·92 cites·14 claims
- 1284US6682955B2Stacked die module and techniques for forming a stacked die moduleMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 27, 2004·25 cites·11 claims
- 1383US6563300B1Method and apparatus for fault detection using multiple tool error signalsADVANCED MICRO DEVICES INC·Filed 2001·Granted May 13, 2003·28 cites·52 claims
- 1479US7186576B2Stacked die module and techniques for forming a stacked die moduleMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 6, 2007·5 cites·21 claims
- 1575US6503777B2Deflectable interconnectMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 7, 2003·12 cites·10 claims
- 1675US6501176B2Deflectable interconnectMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 31, 2002·12 cites·21 claims
- 1768US6925347B1Process control based on an estimated process resultADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 2, 2005·13 cites·29 claims
- 1863US6985825B1Method and apparatus for adaptive sampling based on process covarianceADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 10, 2006·9 cites·21 claims
- 1962US6988225B1Verifying a fault detection result based on a process control stateADVANCED MICRO DEVICES INC·Filed 2002·Granted Jan 17, 2006·8 cites·28 claims
- 2060US5410124ATracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe stripMICRON TECHNOLOGY INC·Filed 1993·Granted Apr 25, 1995·30 cites·20 claims
- 2156US7029931B2Stacked die module and techniques for forming a stacked die moduleMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 18, 2006·4 cites·19 claims
- 2255US6630738B2Deflectable interconnectMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 7, 2003·3 cites·17 claims
- 2354US7755204B2Stacked die module including multiple adhesives that cure at different temperaturesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 13, 2010·3 cites·10 claims
- 2453US2008153204A1Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methodsMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 2539US8184748B2Narrow band receiverMASSAM PETER DAVID·Filed 2009·Granted May 22, 2012·0 cites·22 claims
- 2633US5048664AReciprocating staging fixtureMICRON TECHNOLOGY INC·Filed 1990·Granted Sep 17, 1991·8 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →